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Introduction Defect engineering has a widespread and sophisticated application in the fabrication of microelectronic devices.
Entering nanoscale, however, changes the concept of defect engineering dramatically.
This indicates that defect engineering moves to single atom treatments and a consequent transition to single electron transistors including the employment of quantum mechanical properties associated to the wave behavior of single excess carriers [2].
Forum 590, 29 (2008)
Sverdlov, Strain-induced effects in advanced MOSFETs, Springer, Wien (2011)

Analysis on the Inter-compensatory Problem in Green Building Rating System LEED-NC Based on Energy Saving Tong Zhou1, 2 1School of Architecture, Tianjin University, Tianjin, 300072, China 2College of Civil Engineering and Architecture, Shandong University of Science and Technology, Qingdao, Shandong, 266510, China sdkdzt@sina.com Key words: LEED-NC, Evaluating category, Inter-compensation, Energy saving, Baseline Abstract.
Due to the new prerequisite, LEED2009-NC excludes some projects which have no good energy performance, and ensuring the advance of LEED.
References [1] TopEnergy Green Building Forum: Green Building Assessment, Beijing: China Architecture & Building Press (2007), p. 102 (In Chinese) [2] Information on http://www.usgbc.org/LEED/Project/CertifiedProjectList.aspx [3] Lei Tian: Study on Integrated Building Environmental Performance Assessment System, Nanjing: Dongnan University Press (2007), p. 164(In Chinese) [4] Cathy Turner Mark Frankel, Energy Performance of LEED for New Construction Buildings—Final Report, New Buildings Institute, White Salmon, WA(2008) [5] John H.

Dipole Type Behavior of NO Grown Oxides on 4H–SiC Daniel Haasmann1,2,a *, Hamid Amini Moghadam1,2,b, Jisheng Han1,c, Amirhossein Aminbeidokhti1,2,d, Alan Iacopi1,e, and Sima Dimitrijev1,2,f 1Queensland Micro- and Nanotechnology Centre, Griffith University, Queensland 4111, Australia 2Griffith School of Engineering, Griffith University, Queensland 4111, Australia ad.haasmann@griffith.edu.au, bhamid.aminimoghadam@griffithuni.edu.au, cj.han@griffith.edu.au, da.aminbeidokhti@griffith.edu.au, ea.iacopi@griffith.edu.au, fs.dimitrijev@griffith.edu.au Keywords: 4H–SiC, threshold voltage instability, reliability, MOS capacitor, dipole, oxide.
Introduction Significant advances in SiC technology have enabled the commercialization of SiC MOSFETs in recent years.
Forum, 679 (2011) 366-369

.), Advances in Electrochemical Science and Engineering, vol. 1, p. 127, Verlag Chemie (1990)
[9] A.V.Tripković, K.Dj.Popović, J.D.Lović, Mat.Sci.Forum, 453 (2004), p. 121

Saddow2,6,g* 1NeuroNexus, LLC, Ann Arbor, MI, USA 2Dept. of Electrical Engineering Dept., University of South Florida, Tampa, FL, USA 3Dept. of Mechanical Engineering, University of South Florida, Tampa, FL, USA 4IMM-CNR, Catania, Sicily, IT 5 Moffitt Cancer Center, Tampa, FL, USA 6Dept. of Medical Engineering, University of South Florida, Tampa, FL, USA acfrewin@neuronexus.com, bbeygi.mohamad@gmail.com, cevans.bernardin@outlook.com, dchenyinfeng@usf.edu, efrancesco.lavia@imm.cnr.it, fWilliam.DominguezViqueira@moffitt.org, gsaddow@usf.edu Keywords: Neural Interface, Brain Implants, SiC biomedical, MEMS Abstract.
Single-crystal silicon carbide: A biocompatible and hemocompatible semiconductor for advanced biomedical applications.
Materials Science Forum (Vol. 679, pp. 824-830).
Annual Review of Biomedical Engineering, 11, 1-24. ].
E., Silicon Carbide Biotechnology: A Biocompatible Semiconductor for Advanced Biomedical Devices and Applications.

Perez1, f* 1Nanotechnology Research Laboratory, Department of Chemical Engineering, University of the Philippines Diliman, Quezon City, Philippines 2Laboratory of Electrochemical Engineering, Department of Chemical Engineering, University of the Philippines Diliman, Quezon City, Philippines aedgarclydelopez09@gmail.com, bnicolesaputil@gmail.com, claloza@up.edu.ph, dfgcamiguing@up.edu.ph, emlmopon@up.edu.ph,and fjdperez@up.edu.ph Keywords: Titanium dioxide nanotubes, Co-doping, Photoelectrocatalysis, Response surface methodology Abstract.
Recently, electrochemical advanced oxidation processes gained attention due to their ability to generate ROS in-situ [4–7].
Panizza, Electrochemical advanced oxidation processes: Today and tomorrow.
Vilar, Electrochemical advanced oxidation processes: A review on their application to synthetic and real wastewaters, Appl.
Forum. 950 (2019) 149–153

Engineering College, Bharatpur, Rajasthan-321001, India a2020ppe5203@mnit.ac.in, bpankaj.mech@mnit.ac.in, cblgbharatpur@gmail.com *pankaj.mech@mnit.ac.in Keywords: Hybrid natural fiber reinforced composite, Flax fiber, Wool fiber, Mechanical properties.
In contrast to homogenous materials such as metals, composites are a synergetic combination of more than one engineered material that differs in composition, and form, have two or more distinct phases with a noticeable interface between them and have properties even beyond the limit of those of the constituents [1] [2].
Hybrid polymeric composites are newer and more advanced than conventional fibers reinforced polymer composites.
Rethwisch, Materials science and engineering an introduction, tenth ed., Hoboken, NJ: John Wiley & Sons, Inc., 2018
Forum. 969 (2019) 266–270

Hillstrom: Advances in Design Automation, Vol. 69 (1994) No.2, pp.363
Liu: Materials Science Forum, Vols. 628-629 (2009), pp.329
Xie: Key Engineering Materials, Vol. 522 (2012), pp. 378

Sen, A novel biodegradable cinnamic acid grafted carboxymethyl cellulose based flocculant for water treatment, Materials Science Forum 875 (2016) 156-166
Picchioni, Polymeric surfactants for enhanced oil recovery: A review, Journal of Petroleum Science and Engineering 145 (2016) 723-733
Chen, Recent progress in chemical modification of starch and its applications, RSC Advances 5 (2015) 67459-67474

The Weibull function, in the CDF (Cumulative Distribution Function) definition, is well-known in the field of reliability engineering and failure analysis [7], but it is new in the field of X-ray diffraction to our knowledge.
Science Forum, 347-349 (2000) 17-22
Macherauch, A Useful Guide for X-Ray Stress Evaluation (XSE), Advances in X-ray analysis, 27 (1983) 81-99