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The so-called dynamic mechanical analysis(DMA) is a method to test the materials' dynamic mechanical properties in a certain temperature range and it is also an important method to study the viscoelastic property of material[4] during the 1950s~1960s, most laboratory developed their own instruments to research due to the lack of commercial instruments.
Dynamic Mechanics Analysis (DMA) technology is a method to evaluate polymer thermodynamic properties, compatibility and damping etc.[5,6], which appears an significant action in evaluating of material combination property, design, optimization, materials processing and quality guarantee, etc.
Nevertheless, the mechanical properties of materials research results show that preload and dynamic load size for the dynamic visco-elastic materials parameters have greater effects on it.
Experimental results own an important reference value for further studying dynamic mechanics properties of polymer materials and its physical aging.
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Fig. 3 shows the XRD patterns of the BCN materials deposited at substrate temperatures of 600, 700 and 800 °C, respectively.
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Yakimova: Journal of Crystal Growth Vol. 300 (2007), p. 130

Choosing SSB-2 plate to research the effect of the load and the rotating velocity of the grinding plate to surface roughness Ra and materials remove rate of machining workpieces.
Acknowledgements The work is supported by the National Science Foundation of China (50535040) References [1] N.
Journal of Crystal Growth, 210(1-3) (2000), p. 36-39
Nakagawa: Analysis of mirror surface generation of hard and brittle materials by ELID (Electrolytic In-Process Dressing) grinding with superfine grain metallic bond wheels.
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He, Materials Characterization. 59 (2008) 134-139
Jansto, Materials Science and Engineering A. 527 (2010) 6440-6448
Xue, Journal of Materials Engineering. 5 (2005) 22-26
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Lee, Materials Science and Engineering A. 459 (2007) 40-46

Lu , Q.D Wand and X.Q Zeng, et.al.Materials Science and Engineering A, Vol. 278(2000),p. 66
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Brânduşan c 103-105 Muncii Avenue 400641, Cluj-Napoca, Technical University, Science and Engineering of Materials Faculty, Romania a lidia.matrici@gmail.com, bserban.domsa@stm.utcluj.ro, cliviu.brandusan@staff.utcluj.ro Keywords: injection molding, binder systems, rheological behavior Abstract.
The PIM process evolved from the traditional shape-making capability of plastic injection molding and the flexibility of materials employed in powder metallurgy.
Then the rheograms of the researched materials based on the experimental data have been elaborated.
Pires, Journal of Materials Processing Technology, Vol. 160 (2005), p. 213 [3] C.
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It selects the appropriate permanent magnet material and the liquid fluid, also an articulated manner to the permanent magnet.
Figure .3 Connection Mode With a cylindrical hole between two flexible container is connected With a cylindrical hole , it is simple and convenient that can save materials to reduce weight device.This connection can not only guarantee a certain angle of rotation, but also protect it from not so large range of motion. 
Take K = 0.7, the expression for the actual output power: P=0.13sin （6） The single permanent magnets are arranged in order to carry on the output power of expression，Assume there are N rows， P=0.13Nsin （7） Acknowledgments This study is supported by National Natural Science Foundation (51109129), State Key Laboratory of Ocean Engineering (Shanghai Jiao Tong University)(Grant No.1103)and Shanghai Natural Science Foundation (10ZR1414000).
Experimental Study on Alternating Magnetic Field Magnetohydrodynamic Pump.Journal of Hydrodynamics, Ser.B, vol.20,pp.591-595(2008) [3]M.
Hydrokinetic energy conversion systems: A technology status review.Renewable and Sustainable Energy Reviews, vol. 14, pp. 2996-3004(2010) [4]L.ChunHian.Characterization of the three-dimensional supersonic flow for the MHD generator.Science in China(Series G:Physics,Mechanics & Astronomy),pp. 227-230(2009) [5]E.

Diamond sawing is a mechanical property of contact materials.
Basic characteristics and separation method of wafer (brittle) materials.
Weiss, Laser induced creep and fracture in ceramics, Materials Science and Engineering, 233, pp. 167-175, 1997
Chen, Laser cutting of thick ceramic substrates by controlled fracture technique, Journal of Materials Processing Technology, 136, pp. 166-173, 2003
Huang, Diamond scribing and laser breaking for LCD glass substrates, Journal of Materials Processing Technology, 198, pp. 350-358, 2008

International Journal of Image and Graphics, 2009. 9(02): p. 217-250
Applied Mechanics and Materials, 2011. 39: p. 488-491
International Journal of Mechanics, 2011. 5(2): p. 91-99
International Journal of Computational Vision and Robotics, forthcoming 2013
Progress in Cultural Heritage Preservation, Lecture Notes in Computer Science 2012. 7616 LNCS: p. 9

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