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Kumar, Design of Ultra-Wideband of Rectangular Shaped Emoji Designed Microstrip Patch Antenna of 4.5GHz for Military Applications, 2022 3rd International Conference on Smart Electronics and Communication (ICOSEC), Trichy, India, 2022, pp. 71-75
Safdar, A novel high permittivity ceramic-silicone composite substrate-based antenna for energy harvesting, AEU-International Journal of Electronics and Communications, 2024, 155427
Karim, Fabrication of Cellulose Powder Dielectric Composite Material using Pineapple Leaves Fiber, Journal of Advanced Research in Applied Sciences and Engineering Technology, 38(2), 2024, 1-15
Kennady Shaju Singh, Characterization of new natural cellulosic fibers–a comprehensive review, IOP Conference Series: Materials Science and Engineering, vol. 574, no. 1, 2019, pp. 01201
Proceedings of Engineering and Technology Innovation, 16, 2020, 01-12

Laidani Fondazione Bruno Kessler - Ricerca Scientifica e Tecnologica Plasma Advanced Materials and Surface Engineering Research Unit Via Sommarive 18, 38123 Povo (Trento), Italy Keywords: ZnO thin film, OES, nanoindentation, roughness Abstract.
Abdul Aziz, International journal of hydrogen energy 35 (2010) 4428-4434 [7] D.
Oliver, G.M Pharr, Journal of Materials Research,6 (1992) 1564
Chang, Journal Applied Physics 93 (11) (2003) 9345 [15] M.
Gerberich, Microelectronic Engineering 69 (2003) 519-527 [20] K.Zeng, F Zhu, J.

In order to suppress the plasma-potential variation as much as possible, the pulsed bias voltage feeder in vacuum to the substrate holder is coated with ceramics.
References [1] P.Krulevitch, A.P.Lee, P.B.Ramsey, J.C.Trevino, J.Hamilton, M.A.Northrup, Thin film shape memory alloy microactuators, Journal of Microelectro-Mechanical Systems 5 (4) (1996), pp. 270-282 [2] S.Miyazaki, and A.Ishida, Martensitic transformation and shape memory behavior in sputter-deposited TiNi-base thin films, Materials Science and Engineering A Vol. 273-275 (1999), pp. 106-133 [3] S.Miyazaki, K.Otsuka, C.M.Wayman, Morphological changes associated with the R-phase and martensitic transformations in Ti-Ni single crystals, ISIJ International, 29 (5) (1989), pp. 423-429 [4] J.D.Busch, A.D.Johnson, C.H.Lee, Stevenson, D.A. et al., Shape-memory properties in Ni-Ti sputter-deposited film, Journal of Applied Physics, 68 (12) (1990), pp. 6224-6228 [5] K.R.C.
Gisser, J.D.Busch, A.D.Johnson, A.B.Ellis, Oriented nickel-titanium shape memory alloy films prepared by annealing during deposition, Applied Physics Letters, 61(14) (1992), pp. 1632-1634 [6] CIMTEC2008 ike, Influence of substrate temperature on texture for deposited TiNi films, Proceedings of the 3rd International Conference on Smart Materials, Structures and Systems (CIMTEC 2008), State-of-the-art Research and Application of SMAs Technologies, 59 (2008), pp. 30-34 [7] N.Ikenaga, Y.Kishi, Z.Yajima and N.Sakudo, Low Temperature Crystallization of TiNi Films by Ion Irradiation, The 8th European Symposium on Martensitic Transformations (ESOMAT 2009), 05010 (2009), published by EDP Sciences (www.esomat.org), DOI:10.1051/esomat/200905010, 2009 [8] Y.Kishi, N.Ikenaga, N.Sakudo and Z.Yajima, Transforamation Behavior of Low Temperature Crystallized TiNi Shape Memory Alloy Films, The 8th European Symposium on Martensitic Transformations (ESOMAT 2009), 02012 (2009), published by EDP Sciences

Sumajouw et al.: Australian Journal of Structural Engineering Vol.6(2005), p.77-84
Minerals Engineering Vol.22(2009), p.1073-1078
[28] Z.J.Li, Y.S.Zhang, X.M.Zhou: Journal of materials in civil engineering Vol.17(2005), p. 624-631
[31] T.S.Lin, D.C.Jia: International Journal of Modern Physics,Vol.23(2009), p. 1371–1376
[33] A.Mohd, K.Hussin, M.Bnhussain et al: International Journal of Molecular Sciences Vol.13(2012), p. 7186-7198

Laser Marking of Engineering Thermoplastics: The Polyoxymethylene (POM) Case Study Stanley Udochukwu Ofoegbu1,2,a, Paulo J.
Polyoxymethylene (POM) is a semi-crystalline engineering thermoplastic polymer employed in the manufacturing of precision parts for engineering applications requiring high dimensional stability and good frictional resistance properties.
Polyoxymethylene is an engineering polymer with a linear ether structure (CH2O─)n along its backbone.
References [1] J, Ion, Laser processing of engineering materials: principles, procedure and industrial application.
Jana, A review of the Nd: YAG laser marking of plastic and ceramic IC packages.

A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength Suradet Tantrairatn1,a, Paphakorn Pitayachaval2,b, Sirisak Rangklang1,c Jiraphon Srisertpol1,d 1School of Mechanical Engineering, Institute of Engineering, Suranaree University of Technology, Muang District, Nakhon Ratchasima, 30000 THAILAND 2School of Industry Engineering, Institute of Engineering, Suranaree University of Technology, Muang District, Nakhon Ratchasima, 30000 THAILAND a suradetj@sut.ac.th, b paphakorn@g.sut.ac.th* , c b4609353@hotmail.com, d jiraphon@sut.ac.th Keywords: Electronic Flexible Printed Circuit (E-FPC), Cover Lay, Peel Strength, Hot Bar Machine.
Therefore it has been studied about suitable adhesive formulation for thermal properties of the adhesive after coating the printed circuit and evaluation of adhesive ability between the silicon wafer and ceramic base to compare performance of the adhesive in the electronic industry [1], the adhesive formula improvement for increasing the adhesive endurance properties [2], cove layer manufacturing technology for stepping up adhesive capability between cover layer and circuit board [3], development of testing equipment by IPC-TM650 method using Lab VIEW software to analysis the temperature and time that affect to attachment process and adhesive properties of the flexible damper [4] and a completely random experimental design and application of Taguchi technique to confirm the influence of temperature and time on the percentage of the adhesive [5].
Journal of Applied Polymer Science, 108: 85-92. (2008) [3] C.F.
Pungpipat, in: Optimal hot plate temperature and pressing time in attachment process for flexible damper, Proceeding of the 9th WSEAS International Conference on SYSSTEM SCIENCE and SIMULATION in ENGINEERING (ICOSSSE’10), Iwate, Japan, October 4-6, 2010: 459-463. (2010)

International Journal of Machine Tools & Manufacture, 2005. 45(9): p. 1095-1108
Precision Engineering, 1990. 12(4): p. 227-238
Bhattacharyya, Parametric analysis on electrochemical discharge machining of silicon nitride ceramics.
International Journal of Advanced Manufacturing Technology, 2006. 28(9): p. 873-881
International Journal of Machine Tools & Manufacture, 2006. 46(7-8): p. 828-835

Influence Factors Hierarchization in Electrochemical Discharge Machining (ECDM) Using the Random Balance Method NIOAŢĂ Alin a and CIOFU Florin b Engineering Faculty, University “Constantin Brâncuşi” of Târgu-Jiu, România aalinnioata@yahoo.com, bflorincristian33@gmail.com Keywords: electrochemical discharge machining, intensity, pressure, relative velocity, supply flow, voltage.
Fascio, Machining of non-conducting materials using electrochemical discharge phenomenon - an overview , International Journal of Machine Tools and Manufacture. 45, 9 (2005) 1095-1108
McGeough, An intelligent pulse classification system for electrochemical discharge machining (ECDM) - a preliminary study, Journal of Materials Processing Technology. 149, 1–3 (2004) 499-503
Bhattacharyya, Parametric analysis on electrochemical discharge machining of silicon nitride ceramics, The International Journal of Advanced Manufacturing Technology. 28, 9-10 (2006) 873-881
Paul, Parametric analysis and a soft computing approach on material removal rate in electrochemical discharge machining, International Journal of Manufacturing Technology and Management. 24, 1–4 (2011) 23-39

V.3,e and SHEVTSOVA Maria S.3,f 1Dept. of Microelectronics Engineering at the Kaohsiung Marine University, No.142, Haijhuan Rd., Nanzih Dist., Kaohsiung City 81157, Taiwan (R.O.C.) 2Dept. of Electrical Engineering at the Hwa Hsia University of Technology, No.111, Gongzhuan Rd., Zhonghe Dist., New Taipei City 235, Taiwan (R.O.C.) 3Dept. of Aircraft Engineering at the South Center of Russian Academy, No.41, Tchekhov str., Rostov on Don, Russia a*stephenshchang@me.com, bjiingkae.wu@gmail.com, cwft@cc.hwh.edu.tw, dsergnshevtsov@gmail.com, ezhilyaev@mail.com, fmariamarcs@bk.ru Keywords: Underwater acoustics.
Ting: Journal of Electroceramics Vol. 24(1) (2010), p. 25
Manaf: Indian Journal of Geo Marine Science Vol.40 (2) (2011), p. 176
Shevtsov, et al.: ASME 2014 12th Biennial Conference on Engineering Systems Design and Analysis ESDA2014, Copenhagen, Denmark (2014), 10 p
Bahr, et al.: 11th International Conference on Fracture - ICF11, Turin, Italy (2005), 6 p

SHE, Research on Cyber Security Segregation for Industrial Control Systems, JDCTA: International Journal of Digital Content Technology and its Applications, 5(2011) (8) 9-15
Pharr, Improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, 7(1992):1564-1580
Chen, Mechanical Properties of Diamond Thin Films Characterized by Nano-indentation Method, Journal of the Chinese Ceramic Society, 33(2005)(12):1539-1543
Pharr, Measurement of mechanical propriety by ultra-low load indention, Materials Science Engineering A, 253(1998)151-159
Yang, Nano-hardness Techniques and Its Applications in Mechanical Property Measurements for Surface Engineering, China Mechanical Engineering, 13(2002)24:2148-2151