Sort by:
Publication Type:
Open access:
Publication Date:
Periodicals:
Search results
Online since: January 2022
Authors: Chaimae Abadi, Imad Manssouri, Asmae Abadi
In: Journal of Advanced Manufacturing Systems, DOI: 10.1142/S0219686720500389, (2019)
[2] W.
Engineering design: a systematic approach.
Research in Engineering Design 30(2) (2019) 271-289 [10] M.
Journal of Engineering Design. 29(2018) 20-40
The International Journal of Advanced Manufacturing Technology. 36 (2008) 833-843 [26] S.
Engineering design: a systematic approach.
Research in Engineering Design 30(2) (2019) 271-289 [10] M.
Journal of Engineering Design. 29(2018) 20-40
The International Journal of Advanced Manufacturing Technology. 36 (2008) 833-843 [26] S.
Online since: December 2023
Authors: Mykhaylo V. Yarmolenko, Sergii O. Mogilei
Defect and Diffusion Forum, 413: 47–64. https://doi.org/10.4028/www.scientific.net/ ddf.413.47
[5] YarmolenkoM.
A comprehensive review on green perspectives of electrocoagulation integrated with advanced processes for effective pollutants removal from water environment.
Lecture Notes on Data Engineering and Communications Technologies, vol 178.
A comprehensive review on green perspectives of electrocoagulation integrated with advanced processes for effective pollutants removal from water environment.
Lecture Notes on Data Engineering and Communications Technologies, vol 178.
Online since: January 2016
Authors: František Vajkay, Lenka Gábrová, Michaela Hlásková
Comparative Evaluation of Daylighting Simulation Programs
Lenka Gábrová1, a *, Michaela Hlásková1,b and František Vajkay1,c
1Brno University of Technology, Faculty of Civil Engineering, Institute of Building Structures, Veveří 331/95, 602 00 Brno, Czech Republic
agabrova.l@fce.vutbr.cz, bhlaskova.m@fce.vutbr.cz, cvajkay.f@fce.vutbr.cz
Keywords: Daylighting, daylighting simulations, CIE test cases, ray-tracing, radiosity.
LO1408 “AdMaS UP - Advanced Materials, Structures and Technologies”, supported by Ministry of Education, Youth and Sports under the “National Sustainability Programme I”.
[25] Information on http://forum.dial.de/viewtopic.php?
LO1408 “AdMaS UP - Advanced Materials, Structures and Technologies”, supported by Ministry of Education, Youth and Sports under the “National Sustainability Programme I”.
[25] Information on http://forum.dial.de/viewtopic.php?
Online since: June 2010
Authors: Pyrgiotakis Georgios, Sigmund M. Wolfgang
Acknowledgements
The authors acknowledge the financial support of the Particle Engineering Research Center (PERC)
at the University of Florida, The National Science Foundation (NSF Grant EEC-94-02989), and the
Industrial Partners of the PERC.
Ertl: The Japan Chemical Journal Forum, Vol. 1 (2001), p. 33-45. 2.
Sigmund: Raman Spectroscopy of Anatase Coated Carbon Nanotubes. in 32nd International Conference & Exposition on Advanced Ceramics & Composites. 2008.
Ertl: The Japan Chemical Journal Forum, Vol. 1 (2001), p. 33-45. 2.
Sigmund: Raman Spectroscopy of Anatase Coated Carbon Nanotubes. in 32nd International Conference & Exposition on Advanced Ceramics & Composites. 2008.
Online since: January 2024
Edited by: Mikkel K. Kragh, Dumitru Nedelcu, Khairunisak Abdul Razak
This volume will be helpful to many engineers in the chemical industry, geotechnics, machinery and power engineering.
Online since: August 2004
Authors: Brian Gleeson, Bing Tao Li
Materials Science and Engineering
3157 Gilman Hall
Iowa State University
Ames, IA 50011-2300, USA
bgleeson@iastate.edu; bingtaol@iastate.edu
Keywords: Cyclic oxidation, life prediction, subsurface depletion, chromia scale, diffusion
Abstract.
The numerical model used in this study gives an advanced method for predicting the subsurface Cr depletion profile during cyclic oxidation, in which interfacial Cr content also is obtained.
Forum Vol. 251-254 (1997), p. 57 [20] J.
The numerical model used in this study gives an advanced method for predicting the subsurface Cr depletion profile during cyclic oxidation, in which interfacial Cr content also is obtained.
Forum Vol. 251-254 (1997), p. 57 [20] J.
Online since: November 2021
Authors: Tomasz Tański, Pawel Jarka, Bartlomiej Hrapkowicz, Kinga Jędrzejczak
Effect of the Nanostructures Addition on TiO2 Photoanode and DSSC Properties
Bartłomiej Hrapkowicz1,a*, Kinga Jędrzejczak1,b Paweł Jarka1,c,
Tomasz Tański1,d
1Silesian University of Technology, Department of Engineering Materials and Biomaterials, 44-100 Gliwice Konarskiego 18A, Poland
aBartlomiej.hrapkowicz@polsl.pl, bKinga-jedrzejczak4@wp.pl, cPawel.jarka@polsl.pl, dTomasz.tanski@polsl.pl,
Keywords: Photovoltaics, DSSCs, photoanode, TiO2
Abstract.
Recent advances in dye-sensitized solar cells: From photoanodes, sensitizers and electrolytes to counter electrodes.
In Proceedings of the Materials Science Forum; Trans Tech Publications Ltd, 2018; Vol. 913, pp. 1027–1032
Advances in high efficiency dye sensitized solar cells based on Ru(ii) free sensitizers and a liquid redox electrolyte.
Recent advances in dye-sensitized solar cells: From photoanodes, sensitizers and electrolytes to counter electrodes.
In Proceedings of the Materials Science Forum; Trans Tech Publications Ltd, 2018; Vol. 913, pp. 1027–1032
Advances in high efficiency dye sensitized solar cells based on Ru(ii) free sensitizers and a liquid redox electrolyte.
Online since: October 2006
Authors: Hiroyuki Matsunami, Yuuichi Takeuchi, Rajesh Kumar Malhan, Tsunenobu Kimoto, Mitsuhiro Kataoka
SiC Migration Enhanced Embedded Epitaxial (ME
3
) Growth Technology
Y.Takeuchi1 , M.Kataoka1 , T.Kimoto2 , H.Matsunami3 and R.K.Malhan1
1
DENSO CORPORATION, Research Laboratories, Minamiyama, Nisshin, Aichi 470-0111, Japan
2
Dept. of Electronic Science and Engineering, Kyoto University, Katsura, Kyoto 615-8510, Japan
3
Japan Science and Technology Agency, Ohara Goryo, Nishikyo, Kyoto 615-8245, Japan
E-mail: yuuichi_takeuchi@denso.co.jp
Keywords: Embedded Epitaxy, Migration, pn-junction diode, and Junction Field Effect Transistor,
Abstract.
Amarayunga: 3rd International Conference on Material and Advanced Technologies, Singapore (2005)
Forum Vols. 457-460 (2004), p.189
Amarayunga: 3rd International Conference on Material and Advanced Technologies, Singapore (2005)
Forum Vols. 457-460 (2004), p.189
Online since: January 2019
Authors: Zdenko Tkáč, Anton Panda, Ján Kmec, Milena Kušnerová, Marta Harničárová, Jan Valíček, Zuzana Palková, Ondrej Lukáč
Measurement of the Thermal Properties of Innovative Highly-Insulating Non-Structural Concretes
Milena Kušnerová1,a*, Marta Harničárová1,2b, Jan Valíček1,2c,
Zuzana Palková1,2,d, Zdenko Tkáč2,e, Anton Panda3,f,
Jan Kmec1,g and Ondrej Lukáč2, h
1Department of Mechanical Engineering, Faculty of Technology, Institute of Technology and Business in České Budějovice, Okružní 10, 370 01 České Budějovice, Czech Republic
2Technical Faculty, Slovak University of Agriculture in Nitra, Tr.
Altenbach (Eds.), Advanced Structures materials, Springer Singapore, 2015, pp. 155-165
Koštial, Comparative measurements of the thermal properties of solid materials on a new device and using a new non-stationary method, Def Diff Forum 366 (2016) 366, 63-72
Altenbach (Eds.), Advanced Structures materials, Springer Singapore, 2015, pp. 155-165
Koštial, Comparative measurements of the thermal properties of solid materials on a new device and using a new non-stationary method, Def Diff Forum 366 (2016) 366, 63-72
Online since: July 2020
Authors: James A. Cooper, Hang Jie Liao, Wei Nong Chen, Noah Opondo, Dallas Morisette
Morisette1,e∗
1School of Electrical and Computer Engineering and Birck Nanotechnology Center
Purdue University, West Lafayette, Indiana, USA
2Sonrisa Research, Inc., Santa Fe, New Mexico, USA
a∗nopondo@purdue.edu, bcooperj@purdue.edu, cliao23@purdue.edu, dwchen@purdue.edu,
emorisett@purdue.edu
Keywords: Specific onresistance, substrate resistance, Power MOSFETs.
One way to reduce the substrate resistance is to mechanically thin the substrate, and this is currently employed in the most advanced production devices [2].
Alquier, ICP etching of 4HSiC substrates, Materials Science Forum, Trans Tech Publ, vol. 740 (2013) 825-828 [12] G.M.
One way to reduce the substrate resistance is to mechanically thin the substrate, and this is currently employed in the most advanced production devices [2].
Alquier, ICP etching of 4HSiC substrates, Materials Science Forum, Trans Tech Publ, vol. 740 (2013) 825-828 [12] G.M.