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Online since: August 2013
Authors: Chang Bin Hu, Zeng Hua Sun, Li Juan Wang
It has great connection with the specific climate conditions, pavement structures, material types, paving environment, and curing conditions.
Fig.1 Construction period in main regions of China Typical pavement structure and material properties The typical pavement structure with 0.24 m thick of pavement slab and 0.18 m thick of 5% cement stable base was used in this article.
In addition, the initial temperature of the raw material was supposed to be the average air temperature in a day.
Acknowledgements The authors wish to acknowledge the financial support for this project (Effects of early-age built-in curling on mechanical behaviors of Jointed Plain Concrete Pavement (JPCP) under heavy- load vehicles, No.50908056) from National Natural Science Foundation of China.
Journal of Transportation Engineering. 131(8):599-607, 2005
Online since: February 2016
Authors: Dmitrii Sergeevich Goryainov, Stanislav Rafaelevich Abulkhanov
Selivanov, On issues of damping and shock-absorbing properties of materials and constructions.
Science and Education (electronic edition), No. 6, (2012)
Journal of Modern Optics, Vol. 54, № 6, (2007) 833-844
Kazanskiy, Low-scattering surface plasmon refraction with isotropic materials.
Online since: August 2014
Authors: Jian Gang Ku, Hui Huang Chen, Wen Yuan Liu
Materials and methods Copper ore was collected from copper pit of Yang-la region in the southeastern part of the proved area.
The minute amount of silver and gold showed that the concentrate was suitable for the smelting materials.
Acknowledgement This work is supported by the National Natural Science Foundation of China (Grant No. 51104048), to which the authors express their appreciation.
Prasad: Scandinavian journal of metallurgy Vol. 24(1995), p. 100-105.
Online since: July 2020
Authors: Tobias Erlbacher, Oleg Rusch, Jonathan Moult, Carsten Hellinger, Yunji L. Corcoran
Finding a well-balanced trade-off between removing substrate material to the largest possible extent on one hand and manageable wafer handling capabilities to counteract wafer loss on the other hand is of utmost importance.
Ultraviolet photoluminescence (UVPL) spectroscopy is used as part of the wafer characterization process at IISB to provide information about material quality, in particular for defect analysis [6].
From the perspective of material characteristics, blocking voltage is solely defined by the thickness and doping concentration of the epitaxial layer [7].
Kern, Performance of a 650V SiC diode with reduced chip thickness, Material Science Forum, Vols. 717-220 (2012) pp. 921-924
Kim, Formation of Ni-silicide at the interface of Ni/4H-SiC, Journal of the Electrochemical Society, 158 (2011) pp. 551-553
Online since: March 2016
Authors: Wen Tao Qu, Xu Guang Sun, Jian Sheng Gou, Feng Ling Tang
The FeS it generates is the main material of the pipe blockage.
UHMWPE material has the comprehensive performance of abrasion resistance, impact resistance, self-lubrication, corrosion resistance, absorb impact energy.
Journal of Daqing Petroleum Institute,28(3),2004:49~50
Energy and Environmental Materials II, Vol. 814 (2015) pp 319-324, doi:10.4028/www.scientific.net/MSF.814.319 [9] M.A.
Applied Surface Science,2014, Vol.53,pp.56~61, doi:10.1016/j.apsusc.2014.01.088
Online since: August 2024
Authors: Mihai Lazar, Dominique Planson, Philippe Godignon, Hervé Morel, Ralph Makhoul, Frédéric Richardeau, Nour Beydoun, Abdelhakim Bourennane, David Bourrier, Luong Viet Phung
Godignon, Advanced processing for mobility improvement in 4H-SiC MOSFETs: A review, Materials Science in Semiconductor Processing, Vol. 78 (2018) p. 22
Analysis of the dependence of critical electric field on semiconductor bandgap Journal of Materials Research Vol. 37 (2022) p. 849 [12] M.
Online since: November 2012
Authors: Donato Cancellara, Fabio de Angelis
[15] Cancellara, D., De Angelis, F., Pasquino, V., Displacement based approach for the seismic retrofitting of a RC existing building designed for only gravitational loads, Applied Mechanics and Materials, Vol. 166-169, pp. 1718-1729, 2012
Journal for Multiscale Computational Engineering, Vol. 5, n. 2, pp. 105-116, 2007
[19] De Angelis, F., Multifield potentials and derivation of extremum principles in rate plasticity, Materials Science Forum, Vol. 539-543, pp. 2625-2630, 2007
[20] De Angelis, F., Evolutive laws and constitutive relations in nonlocal viscoplasticity, Applied Mechanics and Materials, Vol. 152-154, pp. 990-996, 2012
[24] De Angelis, F., Cancellara, D., Implications due to different loading programs in inelastic materials, Advanced Material Research, Vol. 422, pp. 726-733, 2012
Online since: February 2018
Authors: Alexey Rodin, Mikhail Mendelev, Boris Bokstein, Aleksei Itckovich
Effect of Atomic Complexes Formation in Grain Boundaries on Grain Boundary Diffusion Alexey Itckovich1,a*, Mikhail Mendelev2,b Alexey Rodin1,c, Boris Bokstein1,d 1The National University of Science and Technology -"MISiS", Moscow, Russia 2Division of Materials Science and Engineering, Ames Laboratory.
Acknowledgements The calculations were performed at supercomputer cluster «Cherry» provided by the Materials Modeling and Development Laboratory at NUST «MISIS»; (supported via the Grant from the Ministry of Education and Science of the Russian Federation No. 14.Y26.31.0005).
Diffusion in Advanced Materials 1 (2014) 99 – 124 [2] B.S.
Simanov, Cu diffusion along al grain boundaries, polish journal of chemistry 83 (2009) 1507-13 [11] M.I.Mendelev, M.J.Kramer, C.A.Becker, Analysis of semi-empirical interatomic potentials appropriate for simulation of crystalline and liquid Al and Cu, M.Asta, Phil.Mag. 88 (2008) 1723 [12] M.I.Mendelev, A.H.King, The interactions of self-interstitials with twin boundaries, Phil.
Online since: December 2011
Authors: Ye Guang Yang, Biao Meng
A Framework for Concurrent 3D Process Design Environment Based on SOA Biao Meng,Yeguang Yang Key Laboratory of Fundamental Science for National Defense of Aeronautical Digital Manufacturing Process, Shenyang Aerospace University, Liaoning, China kongwan69@gmail.com, yyg2004@126.com Keywords: Technology, Process, Collaborative environment, Service oriented architecture Abstract.
T&PMM operates basement data resource according to the process logic in URM, process planning and released technical material, and meanwhile, provides unified URM information statement and standard data management service to upper components with visiting URM model statement service method.
Its result is a modeling & simulation input parameter in collaborative modeling & simulation service, so as to assembly, cutting, sheet metal and composite material.
[S.l.]: IEEE Press, 2005:222-229 [5] In-HoSong and Sung-Chong Chung, XML-based assembly visualization for a multi-CAD digital mock-up system [J], Journal of Mechanical Science and Technology 21 (2007) 1986-1993.
Online since: June 2011
Authors: Liang Feng Shen
It is the extension of building complex whatever residential, office, business or services of space, science and technology, humanities, society and culture this time have been condensated in the building objective appearance and architectural style, which also engraved the particular traditional and local culture with the subjective color, ulteriorly included the residential culture with community living space, the culture grade of human culture and lifestyle of social intercourse contained, which embodies people's rational fashion and quality needs this time
It is contained in higher level with “humanistic care” after meeting the demand of living, and behaved in the construction works which infused more and more elements as ecological, environmental protection and saving energy etc, which includs the highly integrated combination of science and art, experience and technology
The choice of the planning design and the building materials by the enterprises are the choice of culture for posterity in essential
Journal of East China Jiaotong University, 2002(3)
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