Books by Keyword: Integrated Circuit

Description: This proceedings volume contains the proceedings of all presentations of the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) 2023. The subject matter of the UCPSS symposium is ultra-clean processing, isotropic selective etching and surface preparation technology in all steps of the fabrication of micro-and nano-electronic integrated circuits. This volume describes the recent progress in the field of ultra clean surfaces, surface cleaning and preparation for the production of micro- and nano-electronic integrated circuits and related subjects. This involves a wide variety of surfaces of mixed composition and with nano-topography. The goal of the processes is to obtain nano precise etching and cleaning resulting in ultra clean surfaces with a very high degree of perfection, i.e. with minimal amounts of residues or defects. This comprises different surface and cleaning steps throughout the entire device manufacturing process.

Description: The International Conference on Silicon Carbide and Related Materials (ICSCRM) is the most important technical conference series on silicon carbide (SiC) and related materials. Started in Washington, D.C. in 1987, the conference series developed into a bi-annual global forum on SiC from its crystal growth to the reliability in application. After five conferences in the U.S., ICSCRM has been held every two years, alternating between USA, Europe, and Japan. The last three Conferences were held in Giardini Naxos, Italy (2015), Washington, D.C. , USA (2017), and Kyoto, Japan (2019). Due to the pandemic situation in 2020 and 2021, the alternating European edition, the 13th ECSCRM, has been held in 2021, and the 19th ICSCRM has been postponed to 2022. The 19th edition of ICSCRM will be the last of its kind – starting in 2023, the conference series will be united with the European edition. It will form an annual event under the well-established name ICSCRM and a new rotation schedule integrating the SiC communities worldwide.

Description: This special edition contains a collection of articles on research results in areas of structural metal materials, materials and semiconductor devices for applications in photovoltaic systems and electronic devices based on silicon carbide, and also in the area of building materials. The special edition will be helpful to many specialists whose activity is related to machinery and construction, solar cell production and the electronic industry.

Description: This proceedings volume describes the recent progress in the field of ultra-clean surfaces and surface cleaning and preparation for the production of micro- and nanoelectronic integrated circuits and related subjects. This involves a wide variety of surfaces of mixed composition and with nano-topography with an aspect ratio of lateral dimension/vertical dimension on the order of 1/10. The goal of the processes is to obtain nano precise etching and cleaning, resulting in ultra-clean surfaces with very few residues or defects. This comprises different surface and cleaning steps throughout the entire device manufacturing process.

Description: These 425 papers, selected from the 2012 International Conference on Civil, Architectural and Hydraulic Engineering (ICCAHE 2012) held on August 10-12^th 2012 in Zhangjiajie (China), present current knowledge related to “Sustainable Cities Development and Environment”.
They are grouped into 15 chapters:
Architectural Design and its Theory;
Architectural Environment and Equipment Engineering;
Indoor Environment;
Landscape Planning and Design;
Ecological Architecture;
Urban Planning and Design;
Transportation Planning and Traffic Control;
City Ecological Environment;
Environmental Engineering, Environmental Protection and Environmental Biology;
Management and Engineering Education;
Air Environment Control and Architectural Environment Improvement Techniques;
Sustainable City and Regional Development;
Renewable Energy and Building Energy Saving;
Water Purification and Wastewater Treatment;
Transport Engineering