By combining perspective materials processing techniques, device engineering, and circuit integration methods, this special edition provides a comprehensive overview of the state of the art in SiC-based power electronics device fabrication technologies, serving as a valuable resource for researchers, engineers, and practitioners in the field.

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978-3-0364-0911-5

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eBook:

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ToC:

Table of contents

Editors:

Prof. Victor Veliadis and Dr. Arash Salemi

DOI:

https://doi.org/10.4028/b-FAtw6R

THEMA:

TBN, TGM, TJF, TJFC, TJFD

BISAC:

TEC008000, TEC020000, TEC021000

Keywords:

Backside Metal Contact Resistance, Bonded Substrate, Contact Formation, Contact Resistivity, Deep Implantation, Dielectric Stack, Gate Oxide Integrity, Integrated Circuit, Metal-Oxide-Semiconductor Capacitor, MOSFET, Ohmic Contact, Oxidation Process, Planar CMOS, Post Deposition Annealing, Silicon Carbide, Super-Junction Technology, Trench Etching

Details:

Special topic volume with invited peer-reviewed papers only

Pages:

104

Year:

2025

ISBN-13 (softcover):

9783036409115

ISBN-13 (eBook):

9783036419114

Permissions:

Creative Commons CC BY 4.0

Ringgold Subjects:

Materials Science, Manufacturing, Electronics