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                            Engineering Materials: Research and Application Optimization
Description:
This special edition contains a series of articles on research results in areas of materials for applications in opto- and microelectronics and power electronic devices based on silicon carbide. A part of the edition is devoted to properties investigation of green building materials with the use of some waste materials as replacements for conventional components. The issue will be helpful to many specialists whose activity is related to the electronic industry and green construction.
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                    978-3-0364-1329-7
                
            
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                    978-3-0364-0329-8
                
            
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Info:
                    eBook:
                
                
            
                ToC:
            
            
        
                    Editors:
                
                
                    Dr. Hock Jin Quah, Dr. Juraj Marek, Dr. Gregor Pobegen, Prof. Ulrike Grossner, Prof. Steven Y. Liang and Prof. Zongjin Li
                
            
                    THEMA:
                
                
                    TGM, TJ
                
            
                    BISAC:
                
                
                    TEC008000, TEC021000
                
            
                    Keywords:
                
                
Aluminum Slag, Bitumen Binder, Chemical Etching, Diode, Electrical Properties, Ferrous Foundry Sand, Field Effect Transistor, Geopolymer, Green Building Materials, Light Absorption, Metal-Organic Chemical Vapor Deposition, MOSFET, Nanocomposites, Optical Properties, Power Electronic Device, Semiconductor, Silicon Carbide, Thin Film, Wafer Doping, Waste Tyres                
            
                    Details:
                
                
                    Special topic volume with invited peer-reviewed papers only
                
            
                Pages:
            
            
                158
            
        
                Year:
            
            
                2023
            
        
                ISBN-13 (softcover):
            
            
                9783036403298
            
        
                ISBN-13 (eBook):
            
            
                9783036413297
            
        
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Ringgold Subjects:
Materials Science, Building Materials, Electronics