Engineering Tribology, Processing and Modeling

Engineering Tribology, Processing and Modeling

Description:

The presented special issue is dedicated to the recent achievements in materials science and materials processing technologies used in modern mechanical engineering and will be helpful to researchers and engineers from many branches of modern manufacturing.

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Info:

Editors:
Prof. Yunn Lin Hwang and Dr. Thangaprakash Sengodan
THEMA:
PHV, TGM, TJ
BISAC:
SCI041000, TEC008000, TEC021000
Details:
Special topic volume with invited peer-reviewed papers only
Pages:
160
Year:
2024
ISBN-13 (softcover):
9783035718881
ISBN-13 (eBook):
9783035738575
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Ringgold Subjects:

Materials Science, Electronics, Mechanics