Study on Glass Strength at High Speed Edge Rounding for LCD

Nobuyoshi Suzuki; Tatsunoli Halai

doi:10.4028/www.scientific.net/KEM.389-390.448

Paper Titles

Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation
p.424

An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil
p.430

Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing
p.436

Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy
p.442

Study on Glass Strength at High Speed Edge Rounding for LCD
p.448

The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter
p.453

Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
p.459

Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding
p.465

Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation
p.469

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Study on Glass Strength at High Speed Edge...

Study on Glass Strength at High Speed Edge Rounding for LCD

Abstract:

With increasing in size of glass substrates for flat panel, both high productivity and high quality are required for its edge rounding process. In order to understand the effect of process speed on the strength of glass substrate, this study performs a profile grinding at the substrate edge with varied feed rate. The obtained glass substrate then undergoes a four-point bending to evaluate its strength. Weibull distribution is used to analyze the fracture strength of glass substrate after edge-rounding process and to correlate the removal rate with the quality of the process.