Papers by Author: Alexander G. Ulyashin

Abstract: Hydrogen gettering by implantation-disturbed buried layers in oxygen-implanted silicon (Si:O, prepared by O2+ implantation at energy 200 keV and doses 1014 cm-2 and 1017 cm-2) was investigated after annealing of Si:O at up to 1570 K, also under enhanced hydrostatic pressure, up to 1.2 GPa. Depending on processing conditions, buried layers containing SiO2-x clusters and/or precipitates were formed. To produce Si:O,H, Si:O samples were subsequently treated in RF hydrogen plasma. As determined by Secondary Ion Mass Spectrometry, hydrogen was accumulated at the sample surface and within implantation-disturbed areas. It was still present in Si:O,H (D=1017 cm–2) even after subsequent annealing at up to 873 K. Hydrogen accumulation within disturbed areas of Si:O as well as of SOI can be used for recognition of defects in such structures.

Abstract: The research report is devoted to the development of a new method of nanostructures formation in ITO/p-Si/Al structure with powerful laser radiation and study of its optical and electrical properties for solar cells applications. It was shown that after the structure irradiation by Nd:YAG laser second harmonic, dark current voltage characteristics become diode-like. Increase of ITO/p-Si/Al solar cell efficiency after irradiation by the laser, using photocurrent voltage characteristic method, was shown.

Abstract: Accumulation of hydrogen in Czochralski silicon implanted with N2+ (Si:N; N dose, DN=1–1.8x1018 cm-2; energy E=140 keV) or O2+ (Si:O; DO=1x1017 cm-2; E=200 keV), processed at up to 1400 K (HT) under enhanced Ar pressure, up to 1.2 GPa (HP), and followed by treatment in hydrogen (deuterium) plasma, was investigated by Secondary Ion Mass Spectroscopy. Implantation produces buried amorphous layer. As determined by transmission electron microscopy, subsequent HT-HP processing results in a formation of a specific sample microstructure. In plasma treated as-implanted Si:N, hydrogen accumulates at a depth of about 50 nm, up to concentration 2x1021 cm-3. This concentration is twice lower at a depth ≈ 80–250 nm. Deuterium content remains almost unchanged after plasma treatment of Si:N prepared by processing at 1270 K while it is strongly dependent on DN and on HP. In plasma treated Si:O, prepared by processing at 920-1230 K, hydrogen profile corresponds to that of implanted oxygen and decreases with HP. Comparative analysis of hydrogen accumulation and its subsequent release at 720-920 K in the Si:N and Si:O structures indicates that the capacity of buried layers in Si:O to getter and to preserve hydrogen is higher than that in Si:N.

Abstract: Hydrogenated n and p doped Czochralski Si substrates have been studied by means of atomic force microscopy, scanning and transmission electron microscopy, Raman spectroscopy and microwave photoconductivity decay techniques. The measurements show that the surface is roughest in ndoped samples which are plasma treated at high frequency. The cone density was found to be highest on p-doped samples, which correlates well to the higher density of defects observed in pdoped samples. The surface cones were found to consist of nanograins, twins and stacking faults with random orientations, several hydrogen induced defects and bubbles. The size, density and formation depth of the subsurface defects were seen to depend on doping type, doping level, plasma frequency and hydrogenation time. Raman spectroscopy shows formation of nearly free hydrogen molecules, which are presumed to be located in nano-voids or platelets. These molecules dissolved at temperatures around 600°C. By means of the &-PCD measurements, it is demonstrated that hydrogen-initiated structural defects act as active recombination centres, which are responsible for the degradation of the minority carrier lifetime.

Abstract: Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) have been used to compare hydrogen defects formed in p doped [001] oriented Cz silicon samples which are H+ plasma treated , H+ implanted or Si+ implanted + H+ plasma treated. Samples were studied as processed and after annealing at 250°C, 450°C and 600°C. It is found that 1 hour H+ plasma treatment at 250°C produces a low density of large defects (~100 nm) in prefered {111} plans close to the surface. H+ implantation at a dose of 3x1016 cm-2 produces high density of small (~ 20 nm) mostly {100} platelets that after 1 hour annealing at 450°C result in microcrack formation. Lower H+ implantation doses form very few microcracks at this temperature. Silicon implantation with a dose of 1015 cm2 followed by 1 hour H+ plasma treatment at 250°C and 1 hour annealing at 450°C produces similar microstructure and microcracks as the 3x1016 cm2 H+ implantation dose.