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Papers by Author: Didier Louis

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Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect

Authors: Han Xu, Thibaut David, Yin Xu, Vlad Tarasov, Nicolas Possémé, Didier Louis

351

Optimization of a SC CO₂ Post-Etch Cleaning for Copper Interconnections

Authors: Diane Rébiscoul, V. Perrut, C. Ventosa, M. Assous, Didier Louis, G. Passemard

345

Impact of Organic Acid and Gas Bubbling on Copper and Copper Oxide Etch-Rates in Diluted HF Solution

Authors: Diane Rébiscoul, N. Lopez, Lucile Broussous, Didier Louis, G. Passemard

333

Impact of Plasma and Diluted HF on a CoWP Material

Authors: Diane Rébiscoul, Lucile Broussous, N. Lopez, A. Roman, R. Kachtouli, L.G. Gosset, J. Guillan, Didier Louis, G. Passemard

321

Impact of Downstream Ash Plasmas on Ultra Low-k Materials

Authors: Nicolas Possémé, Thibaut David, P. Meininger, O. Louveau, T. Chevolleau, O. Joubert, Didier Louis

337

Copper Decontamination Ability of Supercritical-CO₂/Additives on CVD and Spin-On Porous MSQ Materials

Authors: Jerome Daviot, V. Perrut, F. Gaillard, C. Millet, Adrien Danel, Lucile Broussous, Didier Louis

327

Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives

Authors: Olivier Louveau, Emile Lajoinie, Olivier Pollet, Jean Philippe Odet, Sylviane Cêtre, Laurent Lachal, Béatrice Icard, Evelyne Tabouret, Marc Veillerot, Hervé Fontaine, Didier Louis

301

Post SiN Etching Cleaning During Copper and Low K Integration

Authors: Alessio Beverina, Didier Louis, C. Arvet, E. Lajoinie, Pascal Besson, C. Peyne, Douglas Holmes, D. Maloney, S. Lee, W.M. Lee

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