Papers by Author: Ji Wang Yan

Abstract: . Micro ultrasonic machining (micro-USM) is an effective machining method for hard brittle materials. In the micro-USM process, the workpiece materials are machined through the accumulation of small brittle fractures generated by the impacts of abrasive grains. Therefore, it becomes difficult to obtain a smooth machined surface. In the proposed electrorheological fluid-assisted ultrasonic machining (ER fluid-assisted USM), the behavior of abrasive grains is controlled using the effect of dielectrophoretic force acting on the abrasive grains and the ER effect. The behavior of the abrasive grains can be controlled by changing the electric field distribution. In the present paper, the shape and position of the auxiliary electrode are arranged in order to control the abrasive grains to the side surface of the micro rectangular tool. By positioning the auxiliary electrode parallel to the micro rectangular tool, it becomes possible to concentrate abrasive grains to the side surface of the micro rectangular tool. Smoothing of the side surface of the workpiece by using the side surface of the micro rectangular tool is then investigated. As a result, the surface roughness of the side surface of the workpiece can be improved.

Abstract: Ultraprecision diamond-ground silicon wafers were irradiated by a high-frequency nanosecond pulsed Nd:YAG laser equipped on a four-axis numerically controlled stage. The resulting specimens were characterized using a white-light interferometer, a micro-Raman spectroscope and a transmission electron microscope. The results indicate that around the laser beam center where the laser energy density is sufficiently high, the grinding-induced amorphous silicon was completely transformed into the single-crystal structure. The optimum conditions for one- and two-dimensional overlapping irradiation were experimentally obtained for processing large-diameter silicon wafers. It was found that the energy density level required for completely removing the dislocations is higher than that for recrystallizing the amorphous silicon. After laser irradiation, the surface unevenness has been remarkably flattened.

Abstract: Ultrasonic machining (USM) is an effective machining method for hard brittle materials. In the USM process, the slurry is supplied to the gap between the ultrasonic vibrating tool and the workpiece. Materials are removed by the accumulation of small brittle fractures made by the impacts of abrasive grains. In a previous study, we proposed electrorheological fluid (ER fluid) assisted-USM, and the effect of ER fluid-assisted USM was confirmed practically by machining precise micro-holes and micro-grooves on hard brittle materials. In the present paper, in order to confirm the effect of ER fluid assistance for micro USM in more detail, the behavior of abrasive grains in the machining area is observed. The effect of dielectrophoretic force acts on the abrasive grains and the effect of using ER fluid assistance are investigated. As a result, the abrasive grains can closely approach the micro tool by the effect of dielectrophoretic force and be fixed around the micro tool by the effect of ER fluid assistance. Under these conditions, the workpiece is removed primarily by the accumulation of small brittle fractures, and the chipping can be reduced.

Abstract: This paper investigates the deformation in monocrystalline silicon subjected to single-point cutting with the cutting speed up to 46.78 m/s, the depth of cut of 2 μm, and the feed rate of 5 and 30 μm/rev. Raman spectroscopy and transmission electron microscopy were used to characterize the subsurface damages. It was found that the increase of either the feed rate or cutting speed increases the thickness of amorphous layer and penetration depth of dislocations. At the feed rate of 30 μm/rev and cutting speed of 12.48 m/s, a new dislocation system was initiated. An unknown peak was detected by Raman spectroscopy, which may indicate an unknown Si phase.

Abstract: Ultraprecision diamond-cut silicon wafers were irradiated by a nanosecond pulsed Nd:YAG laser, and the resulting specimens were characterized using transmission electron microscopy and micro-Raman spectroscopy. The results indicate that at specific laser energy density levels, machining-induced amorphous layers and dislocated layers were both reconstructed to a complete single-crystal structure identical to the bulk region. Similar effects were confirmed for diamond-ground silicon wafers. Effects of overlapping irradiation were investigated and perfect crystallographic uniformity was achieved in the boundary region. The recovery process involved rapid melting of the near-surface amorphous layer, followed by epitaxial regrowth from the damage-free crystalline bulk.

Abstract: Thick films are needed in micro-electro-mechanical systems (MEMS) as insulation, piezoelectric and ferroelectric materials. To form the thick film, powder jet deposition (PJD) method has been proposed. In the PJD process, microparticles are sprayed out from nozzle under the conditions of room temperature and atmospheric pressure, and make a film on the substrate. We have developed a new jet mechanism of double-nozzle type, and reported its results previously [1]. In this study, we optimized the shape of the nozzle through investigating the influence of different dimensions and shape of the nozzle on the particles blasting velocity. As a result, it is found that nozzle diameter has a large affect on particles velocity.

Abstract: Ultrasonic machining (USM) is an effective method for machining of hard brittle materials. In this process, the slurry is supplied to the gap between the workpiece and the ultrasonic vibrating tool, and the materials are removed by the impacts of the abrasive grains that are pressurized by an ultrasonic vibrating tool. The purpose of this research is to achieve precise and efficient microfabrication on hard brittle materials by USM. However, in the case of microfabrication, chipping which is generally observed around the edges of machined micro holes and grooves, deteriorates the machining accuracy. In addition, there is another problem in that the machining efficiency decreases with the progress of the machining. Electrorheological fluid-assisted USM has been proposed as a countermeasure to these problems. In the present study, the problems and countermeasures associated with the machining of high-aspect ratio micro holes in hard brittle materials by electrorheological fluid-assisted USM are investigated. By positioning an auxiliary electrode under the workpiece, it becomes possible to keep the electric field high even when the machining depth becomes large. As a result, high-precision and high-aspect ratio micro holes can be machined on hard brittle materials.

Abstract: Reaction-bonded silicon carbide (RB-SiC) is a recently developed ceramic material with many merits such as low manufacturing temperature, dense structure, high purity and low cost. In the present paper, the precision machinability of RB-SiC was studied by microindentation and single-point diamond turning (SPDT) tests. The influence of depth of cut and tool feed rate on surface roughness and cutting force was investigated. Results showed that there was no clear ductile-brittle transition in machining behavior. The material removal mechanism involves falling of the SiC grains and intergranular microfractures of the bonding silicon, which prevents from large-scale cleavage fractures. The minimum surface roughness depends on the initial material microstructure in terms of sizes of the SiC grains and micro pores. This work preliminarily indicates that SPDT can be used as a high-efficiency machining process for RB-SiC.

Abstract: The service life of a diamond tool in cutting single-crystal silicon is normally very short because of severe tool wear. Therefore, it is important to use a proper coolant in order to restrain tool wear. In this paper, the performances of oil-based and water-based coolants were compared in silicon machining by investigating cutting forces and tool wear geometries. The water-based coolant was found to restrain flank wear more effectively than the oil-based one. The effective tool life using the water-based one was averagely three times longer than that using the oil-based one. The tool wear mechanism might be related to microplasma generated between silicon and diamond during cutting.

Abstract: The measurement principle where in a high-NA (Numerical Aperture) surface, for which the degree of the angle of surface inclination exceeds π/3 radians, could be evaluated with high precision and high speed is proposed. This is based on the stitching method, where aspherical surface measurement becomes possible by dividing the surface of the sample into a range so that measurements can be made with an interferometer and finally combined. We examine the method of applying an interferometer to the condition in which the sample is rotated on an air spindle at a constant speed. It is not necessary in this method to make the sample static. Therefore, the vibration of the servo motor and any location errors can be eliminated. Moreover, the measurement time does not depend on the number of divided areas which are necessary for the stitching method, allowing for high-speed measurement. The principle behind this technique is expanded first, and an experiment system based on it was constructed. The principle proposed was evaluated, and its effectiveness was confirmed.