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Articles by author: Wim Fyen

• A Force Study in Brush Scrubbing
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p279)
• Effect of Transient pH on Particle Deposition during Immersion Rinsing
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p139)
• Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers
  Published in: Ultra Clean Processing of Silicon Surfaces V (p251)
• Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
  Published in: Ultra Clean Processing of Silicon Surfaces V (p39)
• Particle Deposition and Removal from Ge Wafers
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p173)
• Particle-Substrate Interaction Forces in a Non-Polar Liquid
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p165)
• Pattern Dependent Corrosion Effects in HF Based Post Cu CMP Cleanings
  Published in: Ultra Clean Processing of Silicon Surfaces V (p275)
• Performance of a Linear Single Wafer IPA Vapour Based Drying System
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p75)
• Procedure to Evaluate Particle-Substrate Interaction during Immersion in Liquid
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p53)
• Relation between Particle Density and Haze on a Wafer: a New Approach to Measuring Nano-Sized Particles
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p161)
• Removal of Nano-Particles by Mixed-Fluid Jet: Evaluation of Cleaning Performance and Comparison with Megasonic
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p193)
• Rinsing and Drying Effects on Heterogeneous Substrates
  Published in: Ultra Clean Processing of Silicon Surfaces V (p195)
• Use of Surfactants for Improved Particle Performance of dHF-Based Cleaning Recipes
  Published in: Ultra Clean Processing of Silicon Surfaces V (p263)