Research of Film Uniformity on Vacuum Coating by Magnetron Sputtering with Multi-Sites

Abstract:

A new type of multi-site magnetron sputtering system has been researched, which has more than one workbench. Based on the operating principle of the magnetron sputtering system which with a circular plane target, a mathematical model has been developed to simulate and discuss the influencing factors on the film thickness uniformity. The results showed that when the substrates were rotating axially and eccentrically, the film thickness distribution were affected by both the target-substrate distance and the eccentricity. If the eccentricity was constant, the film thickness would become thinner when the target-substrate distance increased, and the thickness uniformity tended to be improved. If the target-substrate distance was constant, the thickness uniformity would become better when the eccentricity increased. Moreover, if the substrate rotated axially and revolved around the target simultaneously, the thickness uniformity would become better when velocity ratio of axial rotation to revolution increased. And the effect of the thickness uniformity became small gradually if the ratio increases to a certain degree. In addition, increasing the etching area properly not only could conduct the film distribution to better, and improve the substrate film thickness uniformity also. Finally, taking a series of experiments, and analyzing the experimental data, the conclusion of the study results in the paper had been verified.

• Periodical: Advanced Engineering Forum (Volumes 2-3)
• Pages: 1082-1087
• DOI: https://doi.org/10.4028/www.scientific.net/AEF.2-3.1082
• Online since: December 2011
• Authors: Ying Huang, Shi Tie Gao, Meng Liu
• Keywords: Eccentricity, Magnetron Sputtering, Target-Substrate Distance, Thickness Uniformity

References

[1] X.Q. Meng, D.Z. Ren, H.X. Guo, et al., Calculation of growth rate and thickness uniformity of the film deposited by cathode hollow magnetron sputtering, Journal of Wuhan University (Natural Science Edition), 41(1995) 351-356.

[2] F. Tatsuo, S. Fumihiko, N. Masahiko, Observations on the operation of a planar magnetron sputtering system by target erosion patterns, Thin Films, 153(1987) 373-381.

DOI: 10.1016/0040-6090(87)90136-2

[3] L.G. Han , Researched of coating equipment and film uniformity on plane target by magnetron sputtering with multi-workbench, University Journal of Electronic Science and Technology of China, 20(2004) 24-25.

[4] D.L. Pan , M.S. Xiong, Y.D. Zhang, et al., Flim uniformity calculation of large caliber coating machine, High Power Laser and Particle Beams. 12(2000)277-280.

[5] M. Fang, X. Z Fan, J. B. Huang, Numerical simulation of a flat planetary fixture for physical vapor deposition, Chinese Journal of Computational Physics, 23(2006)738-742.

[6] X.D. Wang, D.C. Ba, S. W. Zhang, Y. C. Zhang, Vacuum Technology, Metallurgical Industry Press, Beijing, (2006).