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Study on Curing Reaction and Mechanical Properties of Liquid Crystalline P-SBPEPB/BPAER/MeTHPA System

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Abstract:

The cure kinetics for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypropyloxy)benzoate](p-SBPEPB), with3-methyl-tetrahy drophthalic anhydride (MeTHPA) as a curing agent, were investigated by nonisothermal differential scanning calorimetry (DSC) method. The effect of the different liquid crystalline contents and activation energy (Ea) on curing reaction were discussed. The glass transition temperature (Tg) and mechanical property were charactered, The results show that the better content is about 10wt%.

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Periodical:

Applied Mechanics and Materials (Volume 109)

Pages:

170-173

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.109.170

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Online since:

October 2011

Authors:

Li Huo, Yong Gang Du, Yong Mei Wang

Keywords:

Curing Kinetics, Epoxy Resin (ER), Liquid Crystalline, Mechanical Property, Modify

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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