Research on Interface Structure and Fracture Mechanism of Diffusion Bonding of Titanium Alloy/Cu/Stainless Steel

Abstract:

Using analysis methods of stretching test，SEM，EDS and microhardness test to investigate and research the mechanical properties, the fracture mechanism，the reacting phases are produced and the distribution range of vacuum diffusion bonding joints of Ti-6Al-4V/Cu/304. The results show that when bonding pressure is 5.0 MPa, the tensile strenght of the joint increases at first, but decreases with the increasing of bonding temperature and time, When bonding temperature is 1223K, bonding time is 3.6ks, there is a maximum tensile strength that is 163 Mpa. However, it will be disadvantageous to the performance of the joints, when bonding temperature and time extended overly. Using Copper foil as the interlayer, the intermetallic compounds did not generate in interface of Cu/304，Therefore, it formed multi-phase transition organizations by solid solution, intermetallic compounds in interface of Titanium alloy/Cu，such as Ti_xCu_y, Ti_xFe_y and so on. The effect of Ti_xCu_y on strength of the joints is slightly larger than Ti_xFe_y compound. The fracture mainly happened in the titanium alloy side Ti₂Cu intermetallic compound in region Ⅱfor the source dehiscence, developping inⅡ-Ⅲ area junction weak intermetallic compounds of diffusion layer. It is brittle fracture. Therefore, it is the main way to improve the joint strength by improving the interface structure of titanium alloy/Cu side.

• Periodical: Applied Mechanics and Materials (Volumes 117-119)
• Pages: 380-384
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.117-119.380
• Online since: October 2011
• Authors: Shu Ying Liu, Guang Bao Liu, Zhong Hao Heng, Kuan Xu
• Keywords: Bonding Interface, Diffusion Bonding (DB), Fracture Machanism, Interface Structure, Interlayer, Intermetallic Compound (IMC)

References

[1] M. Ghosh and S. Chatterjee. Characterization of transition joints of commercially pure titanium to 304 stainless steel. [J]. Materials Characterization. 2002, 48 (5)：393-399

DOI: 10.1016/s1044-5803(02)00306-6

[2] HAN Jing, SHENG Guangmin, QIN Bin, et al. Research Status in Diffusion Bonding 0f Titanium alloy to Stainless Steel. [J]. Materials for Mechanical Engineering. 2007，31(12):1-3

[3] SUN Ronglu, ZHANG Jiuhai. Welding Problems and Present Situation of Titanium or Titanium Alloy and Steel. [J]. Aerospace Materials & Technology. 1997，27(2)：7-l1．

[4] QIN Bin, SHENG Guangmin, ZHOU Bo, et al. Diffusion bonding of titanium alloy to stainless Steel. [J]. The Chinese Journal of Nonferrous Metals. 2004，14(9)：1545-1550

[5] ZHOU Ronglin, GUO Delun, ZHANG Yingen. Effect of Phase transformation diffusion bonding technological parameters on joint strength of titanium and stainless steel. [J]. The Chinese Journal of Nonferrous Metals. 2002，12(4): 663-667

[6] YUAN Jianxin, SHENG Guangmin, QIN Bin, et al. Effect of technological parameters of impact pressure diffusion bonding on joint strength of titanium alloy and stainless steel. [J]. Journal of aeronautical materials. 2006, 26(4)：51-55

[7] FENG Jicai, LI Zhuoran, HE Peng, et al. Interface structures and phase growth of TiAl/40Cr diffusion bonded joint. [J]. The Chinese Journal of Nonferrous Metals. 2003, 13(1)：162-165.

[8] ALEMAN B. ; GUTIERREZ I. ; URCOLA J. J. Interface microstructures in diffusion bonding of titanium alloys to stainless and low alloy steels. [J]. Materials science and technology. 1993，9(8)：633-641

DOI: 10.1179/mst.1993.9.8.633

[9] ZHANG Guifeng，ZHANG Jianxun，PEI Yi，et al. Modification of Design for Interlayer in Transient Liquid Phase (TLP) Bonding of Metal Matrix Composites. [J]. Hot Working Technology. 2006, 35(19):28-31

[10] Qin Bin, Sheng guangmin, Huang Jiawei, et al. Fracture analysis of diffusion bonded joint between titanium alloy and stainless stell. [J]. Iron Steel Vanadium Titanium. 2005, 26(4): 55-59.

[11] OhashiO. Diffusion bonding of different metal material.[J].Joumal of Japan Welding Institute. 1988, 56(3):13-17

[12] WANG Yu, XIE Chunsheng, LI Xiaoquan, et al. Solid phase diffusion bonding of CuAlBe/Ni/1Cr18Ni9Ti. Journal of East China Shipbuilding Institute. 1999，13(6)：47-50