Fixed-abrasive diamond wire saw is widely used for slicing semiconductor materials. In this paper, a novel manufacturing method is studied by using polyethylene wire to replace the traditional metallic core wire. A new coating device of ultraviolet-curing for rapidly making diamond wire saw is developed. In terms of tensile strength experiments’ results, a high strength polyethylene multi-strand wire is finally selected as the core wire of the fixed-abrasive wire saws. Experimental results show that the high tensile strength of polyethylene multi-strand wire can satisfy the technical requirements of fixed-abrasive wire saws.