Effect of Strain Rates on the Mechanical Behavior of Cu Thin Films of Various Thicknesses

Kuan Jung Chung; Chi Feng Lin; W. C. Chiang

doi:10.4028/www.scientific.net/AMM.284-287.94

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 284-287Effect of Strain Rates on the Mechanical Behavior...

Effect of Strain Rates on the Mechanical Behavior of Cu Thin Films of Various Thicknesses

Abstract:

The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10^-4 s^-1, 1.6×10^-3 s^-1, and 1.6×10^-2 s^-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.