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The Higher Order Crack Tip Fields for Anti-Plane Crack in Functionally Graded Piezoelectric Materials

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Abstract:

The anti-plane crack problem is studied in functionally graded piezoelectric materials (FGPMs). The material properties of the FGPMs are assumed to be the exponential function of y. The crack is electrically impermeable and loaded by anti-plane shear tractions and in-plane electric displacements. Similar to the Williams solution of homogeneous material, the high order asymptotic fields are obtained by the method of asymptotic expansion. This investigation possesses fundamental significance as Williams solution.

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Periodical:

Applied Mechanics and Materials (Volume 472)

Pages:

617-620

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.472.617

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Online since:

January 2014

Authors:

Yao Dai, Xiao Chong, Shi Min Li

Keywords:

Anti-Plane Crack, Asymptotic Expansion Method, Crack Tip Fields, FGPMs

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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References

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