Thermal Fatigue Analysis of HSK Shrink Toolholder

Jian Chen; Liang Tian; Hong Mo Shang; Gui Cheng Wang

doi:10.4028/www.scientific.net/AMM.532.408

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 532Thermal Fatigue Analysis of HSK Shrink Toolholder

Thermal Fatigue Analysis of HSK Shrink Toolholder

Abstract:

The principle which the tool is embedded into the HSK shrink toolholder is expanding with heat and contracting with cold. The thermal cycle that the tool is embedded into or taken out the toolholder is heating toolholder and cooling it quickly. After a few thermal cycles, the HSK shrink toolholder is damaged with the way of thermal fatigue. The analysis of thermal fatigue is transient heat transfer and stress coupling and the temperature distributionstress and strain of every time are gained in thermal cycle. The fatigue of shrink tool holder is strain fatigue by analyzing the stress. The fatigue life is gained with Coffin-Manson formula.

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Periodical:

Applied Mechanics and Materials (Volume 532)

Pages:

408-412

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.532.408

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Online since:

February 2014

Authors:

Jian Chen, Liang Tian, Hong Mo Shang, Gui Cheng Wang*

Keywords:

Shrinktoolholder, Thermalfatigue, Transient Heat Transfer

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* - Corresponding Author

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