Strength Analysis of Epoxy Molding Compound Module Using Automated FEA System

Joon Seong Lee; Hee Rok Hong; Gye Hyun Jo; Dong Keun Park

doi:10.4028/www.scientific.net/AMM.670-671.852

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 670-671Strength Analysis of Epoxy Molding Compound Module...

Strength Analysis of Epoxy Molding Compound Module Using Automated FEA System

Abstract:

Recently, consumers are often dissatisfied with the battery life from even the most advanced lithium-ion rechargeable batteries in mobile phone. A mobile battery was chosen in this study because it is the flat plate of small thin wall which is expected to have some flexing. It is required to be evaluated and designed considering the coupled phenomena. Especially, this paper describes finite element analysis simulation of strength evaluation for epoxy molding compound module using automated FE analysis system.

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Periodical:

Applied Mechanics and Materials (Volumes 670-671)

Pages:

852-855

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.670-671.852

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Online since:

October 2014

Authors:

Joon Seong Lee*, Hee Rok Hong, Gye Hyun Jo, Dong Keun Park

Keywords:

Epoxy Molding Compound Module, Finite Element Method (FEM), Lead Frame, Protection Module Package, Strength Analysis

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* - Corresponding Author

References

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