Applied Mechanics and Materials Vols. 713-715

Abstract: The influence of natural evaporation factors (the irradiation intensity, speed of the wind, temperature of the brine, temperature and relative humidity of the air) on the desalinated seawater evaporation rate was measured experimentally. A natural evaporation model was built by correlating the experimental data using the artificial neural network. This model was well correlated with the influence of natural evaporation factors, and it showed a good agreement of the results and evaporation theory.

Abstract: Pyrolysis behavior and kinetics of walnut shell were investigated using thermogravimetic analysis in this study. It was shown that kinetics parameters and model of the walnut shell pyrolysis were determined by the relevant parameter of kinetics calculated using Achar differential and the Šatava-Šesták integral methods. 3D Diffusion model (Z-L-T equation) was fitted to walnut shell pyrolysis mechanism with activated energy from 184.08 to 196.88 KJ/mol.

Abstract: This paper selects petroleum ether as an extraction solvent, use ultrasonic to assisted extraction of Malabar spinach oil, research of extraction temperature, ultrasonic power extraction, extraction time, solid-liquid ratio on Malabar spinach oil extraction rate by orthogonal, extract rate was used as the main criterion to determine the optimum process conditions. The results showed that: the optimum conditions was ultrasonic power 135W, extraction temperature 40 °C, extraction time 25min, solid-liquid ratio 1:10. Identified 19 kinds of main ingredientby GC-MS analysis.

Abstract: this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.