Evaluation of the Effects of Copper Electroplating Parameters on the Adhesion Using Response Surface Methodology

Farag Haider; Suryanto Suryanto; Mohd Hanafi Ani; M.H. Mahmood

doi:10.4028/www.scientific.net/AMM.864.121

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 864Evaluation of the Effects of Copper Electroplating...

Evaluation of the Effects of Copper Electroplating Parameters on the Adhesion Using Response Surface Methodology

Abstract:

In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO₄ and H₂SO₄ concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO₄ and decreasing theat of H₂SO₄ strengthens adhesion. Conversely, the current density only has a slight effect.

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Applied Mechanics and Materials (Volume 864)

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121-126

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.864.121

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Online since:

April 2017

Authors:

Farag Haider*, Suryanto Suryanto, Mohd Hanafi Ani, M.H. Mahmood

Keywords:

Adhesion Strength, Copper Coating, Electroplating, Stainless Steel

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