Effect of Deposition Time on Structure of TiAlN Thin Films Deposited by Reactive DC Magnetron Co-Sputtering

Abstract:

Titanium aluminum nitride (TiAlN) thin films were deposited by reactive DC magnetron co-sputtering technique on Si substrate. The effect of deposition time on the structure of the TiAlN films was investigated. The crystal structure, surface morphology, thickness and elemental composition were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and energy dispersive X-ray spectroscopy (EDS) technique, respectively. The results showed that, all the as-deposited films were formed as a (Ti,Al)N solid solution. The as-deposited thin films exhibited a nanostructure with a crystallite size of less than 30 nm. The film thickness increase from 115 nm to 329 nm, while the lattice parameter decrease from 4.206 Å to 4.196 Å, with increasing of the deposition time. Cross section analysis by FE-SEM showed compact columnar and dense morphology as a result of increasing the deposition time. The elemental composition of the as-deposited films varied with the deposition time.

• Periodical: Applied Mechanics and Materials (Volume 866)
• Pages: 318-321
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.866.318
• Online since: June 2017
• Authors: Nirun Witit-Anun*, Adisorn Buranawong
• Keywords: Deposition Time, Reactive DC Magnetron Co-Sputtering, Thin Films, TiAlN

References

[1] W.L. Wang, R.Q. Zhang, K.J. Liao, Y.W. Sun, B.B. Wang, Nucleation and growth of diamond films on aluminum nitride by hot filament chemical vapor deposition. Diamond and Related Materials. 9(2000) 1660-1663.

DOI: 10.1016/s0925-9635(00)00321-6

[2] W.K. Chung, H.K. Kwang, Anti-oxidation properties of TiAlN film prepared by plasma-assisted chemical vapor deposition and roles of Al. Thin Solid Films. 307(1997) 113–119.

DOI: 10.1016/s0040-6090(97)00212-5

[3] A. Buranawong, N. Witit-anun, S. Chaiyakun, A. Pokaipisit, P. Limsuwan, The effect of titanium current on structure and hardness of aluminium titanium nitride deposited by reactive unbalanced magnetron co-sputtering. Thin Solid Films. 519(2011).

DOI: 10.1016/j.tsf.2011.01.062

[4] L. Wei, L. Ping, W. Juntao, M. Fengcang, L. Xinkuan, C. Xiaohong, H. Daihua. Investigation on microstructure and mechanical properties of reactively synthesized TialN/AlON nanomultilayers. Vacuum. 86(20123) 1300-1304.

DOI: 10.1016/j.vacuum.2011.11.019

[5] P.W. Shum, K.Y. Li, Y.G. Shen, Improvement of high-speed turning performance of Ti–Al–N coatings by using a pretreatment of high-energy ion implantation, Surface and Coatings Technology. 198(2004) 414-419.

DOI: 10.1016/j.surfcoat.2004.10.109

[6] O.A. Fouad, A.K. Rumaiz, S.I. Shah, Reactive sputtering of titanium in Ar/CH4 gas mixture: Target poisoning and films characteristics. Thin Solid Films. 517(2009) 5689-5694.

DOI: 10.1016/j.tsf.2009.02.119

[7] K. Wasa, S. Hayakawa, Handbook of Sputter Deposition Technology, Noyes, New Jersey, (1992).