The Plasma Treatment Influence on the Adhesive Wafer Bonding by the PDAP

Abstract:

This paper focus on the Oxygen plasma surface treatment affect on the bonding strength. In shearing force tests , total 10 samples were tested. Through the shear force tests, it indicates that moderate exposure to O₂ plasma could increase the bonding strength to some extent. Then the AFM tests results shows that the MR-I 9100M coating topography is about 14 nm, while after Oxygen plasma treatment the topograhy decrease to 7.9 nm. And the MR-I 9150M coating topography is about 5.5 nm, while after Oxygen plasma treatment the topograhy decrease to 4.6 nm. By AFM tests, it can be found that the Oxygen plasma surface treatment cause the decrease of the surface roughness. And it puts forward another possible explanation for the Oxygen plasma treatment can improve the bonding strength.

• Periodical: Advanced Materials Research (Volume 1015)
• Pages: 526-530
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1015.526
• Online since: August 2014
• Authors: Zhong Fang, Tao Dong*, Yong He, Yan Su
• Keywords: Adhesive Bonding, Atomic Force Microscope, Bond Strength, Surface Roughness (SR), Wafer Bonding

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