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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1018Micromachining of Silicon - Study on the Material...

Micromachining of Silicon - Study on the Material Removal Mechanism

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Abstract:

The growing demand for micro products of hard and brittle materials requires suitable manufacturing processes, which serve high structure quality and accuracy. Therefore, micro pencil grinding tools are used. While grinding hard and brittle materials the structure quality and accuracy depends on the material removal mechanism. This mechanism is a complex interaction between the process parameters, the material response and the tool geometry. In this paper the influence of the process parameters, particularly the cutting speed and the feed rate, on the material removal mechanism are discussed. Furthermore, a method for the analysis of the structure quality and accuracy and within the material removal mechanism is shown.

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Periodical:

Advanced Materials Research (Volume 1018)

Pages:

167-174

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1018.167

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Online since:

September 2014

Authors:

Marina Carrella*, Jan C. Aurich

Keywords:

Grinding, Manufacturing, Micro Machining

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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