Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel

Jian Xiu Su; Jia Peng Chen; Hai Feng Cheng; Song Zhan Fan

doi:10.4028/www.scientific.net/AMR.1027.167

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1027Analysis on the Influence of Oxidant in CMP of...

Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel

Abstract:

In chemical mechanical polishing (CMP) of ultra-thin stainless steel, the oxidant of polishing slurry determines the material removal rate (MRR). In this paper, the influences of oxidant in slurry on MRR and surface roughness have been studied in CMP of ultra-thin 304 stainless steel based on alumina (Al₂O₃) abrasive. The research results show that, in the same conditions, the MRR increases with the increase of the oxidant C and the oxidant B, the MRR decreases with the increase of the oxidant A and the MRR is max with the oxidant C. It indicated that the oxidant C has a large effect on MRR in CMP of the 304 stainless steel. The research results can provide the reference for studying the slurry in CMP of ultra-thin stainless steel.

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Periodical:

Advanced Materials Research (Volume 1027)

Pages:

167-170

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1027.167

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Online since:

October 2014

Authors:

Jian Xiu Su*, Jia Peng Chen, Hai Feng Cheng, Song Zhan Fan

Keywords:

Chemical Mechanical Polishing, Material Removal Rate (MRR), Oxidant, Polishing Slurry, Surface Roughness (SR), Ultra-Thin Stainless Steel

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