Thermal Stability of an Epoxy Adhesive

Mei Li; Xiang Yu Zhao; Wei Shao; Chuan Bao Ma; Rui Xue Zheng; Ya Dong Chen

doi:10.4028/www.scientific.net/AMR.1053.257

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1053Thermal Stability of an Epoxy Adhesive

Thermal Stability of an Epoxy Adhesive

Abstract:

An epoxy adhesive and its curing agent are tested using differential scaning calorimetry under different atmospheres and after different exposure times to natural air to analyze its thermal properties. The results show that after the pure epoxy, the curing agent and the adhesive mixture of them are exposed in natural air for different period of time, all show different levels of decline in thermal stability and more complicated reactions when tested in the DSC and TGA in O2 and air, while the thermal properties remain stable when they are tested in an inert gas like N2. And according to the mechanical property tests and SEM results, the mechanical properties of the adhesive mixture in N2 are better than that in air. The results indicate that inert gas can protect the property of this kind of adhesive and thus increase its bond strength.

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Periodical:

Advanced Materials Research (Volume 1053)

Pages:

257-262

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1053.257

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Online since:

October 2014

Authors:

Mei Li*, Xiang Yu Zhao, Wei Shao, Chuan Bao Ma, Rui Xue Zheng, Ya Dong Chen

Keywords:

Adhesion, Carbon Fiber Reinforced Polymer, Mechanical Property, Thermal Properties

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* - Corresponding Author

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