Machining Force and Modes for Si Wafer Machining with Rotational Tool

Nobumasa Yokemura; Kenichiro Imai; Hiroshi Hashimoto

doi:10.4028/www.scientific.net/AMR.126-128.289

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Machining Force and Modes for Si Wafer Machining...

Machining Force and Modes for Si Wafer Machining with Rotational Tool

Abstract:

In this study, basic experiments involving machining using a rotational tool were conducted with the aim of increasing the volume of material removed rate in ductile-mode machining of Si wafers. The machining surface and machining force was compared to experimentally clarify the material removal process for a single cutting edge, the critical cutting thickness tc at which occurs of cracks was set as the machining condition. Then, the three machining modes were experimentally revealed. As the result, the ductile-mode machining surface was obtained that the total depth of cut was under less than 78.5μm on ductile-brittle-mode machining.

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Periodical:

Advanced Materials Research (Volumes 126-128)

Pages:

289-294

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.126-128.289

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Online since:

August 2010

Authors:

Nobumasa Yokemura, Kenichiro Imai, Hiroshi Hashimoto

Keywords:

Ductile Mode Machining, Machining Force, Material Removal Process, Rotational Tool, Si Wafer

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References

[1] K. Abe, N, Yasunaga, M, Miyashita, J, Yoshioka and M, Daito: Development of Ultraprecision Grinding Equipment for Ductile Mode Grinding of brittle Materials, Journal of the Japan Society for Precision Engineering, Vol. 59, No. 12, pp.1985-1990.

DOI: 10.1016/b978-0-7506-9484-1.50020-8

Google Scholar

[2] Y. Icida, N. Ben Frej and R, Yousefi: Ductile-mode Mirror Cutting of Single Crystal Silicon (1st Report)-Effects of Cutting Speed on the Brittle/Ductile Mode Transition Behavior in Cutting Process- , Journal of the Japan Society for Precision Engineering, Vol. 64, No. 9, pp.1345-1349.

DOI: 10.2493/jjspe.64.608

Google Scholar

[3] J. Yan, K, Syoji, H, Suzuki and T, Kuriyagawa: Ductile Regime Turning of Single Crystal Silicon with a Straight-Nosed Diamond Tool, Journal of the Japan Society for Precision Engineering, Vol. 64, No. 4, pp.608-612 (Apr 1998).

DOI: 10.2493/jjspe.64.1345

Google Scholar