Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer

Abstract:

As a new fixed-abrasive machining method, chemo-mechanical grinding (CMG) is developed from chemical mechanical polishing (CMP), with the obvious advantage of geometric accuracy determinacy and no slurry. To improve material removal rate and enhance the popularity of CMG, this paper introduces a combined grinding method, i.e., two dimensional ultrasonic vibration assisted CMG (2D-UACMG). Si wafer is taken as the workpiece and the influence of ultrasonic vibration modes and process parameters on the surface roughness and the material removal is examined. The results show 2D-UACMG can obtain better surface quality with little surface damage at nanometer level compared with the conventional CMG without the ultrasonic vibration.

• Periodical: Advanced Materials Research (Volumes 126-128)
• Pages: 282-288
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.126-128.282
• Online since: August 2010
• Authors: Zhen Zhong Wang, Yong Bo Wu, Li Bo Zhou, Yin Biao Guo, Chen Xu Wu
• Keywords: Chemo-Mechanical Grinding (CMG), Machining Efficiency, Surface Accuracy, Surface Damage, Two Dimensional Ultrasonic Vibration

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