Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film
The distributions of residual stresses for zinc-plated film were measured quantitatively by X-ray diffraction (XRD), its interfacial structures were observed with scanning electron microscope (SEM). The effects of residual stress on bonding strength of zinc-plated film were investigated, and its influence mechanism was discussed. The experimental results show that residual stresses of zinc-plated film are behaved as tensile stress, which increase with its thickness, bonding strength of zinc-plated film is inverse ratio with residual stresses; the effects of residual stress on film crack are obvious, tensile stress speeds film cracking, which decrease its bonding strength; bonding strength of zinc-plated film is increased by improving its residual stress distribution.
Hun Guo, Zuo Dunwen, Tang Guoxing
X. F. Wang "Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film", Advanced Materials Research, Vol. 142, pp. 112-116, 2011