Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film

Abstract:

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The distributions of residual stresses for zinc-plated film were measured quantitatively by X-ray diffraction (XRD), its interfacial structures were observed with scanning electron microscope (SEM). The effects of residual stress on bonding strength of zinc-plated film were investigated, and its influence mechanism was discussed. The experimental results show that residual stresses of zinc-plated film are behaved as tensile stress, which increase with its thickness, bonding strength of zinc-plated film is inverse ratio with residual stresses; the effects of residual stress on film crack are obvious, tensile stress speeds film cracking, which decrease its bonding strength; bonding strength of zinc-plated film is increased by improving its residual stress distribution.

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Periodical:

Edited by:

Hun Guo, Zuo Dunwen, Tang Guoxing

Pages:

112-116

DOI:

10.4028/www.scientific.net/AMR.142.112

Citation:

X. F. Wang "Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film", Advanced Materials Research, Vol. 142, pp. 112-116, 2011

Online since:

October 2010

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$35.00

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