Effects of Residual Stress on Interfacial Bonding Strength of Zinc-Plated Film

Abstract:

The distributions of residual stresses for zinc-plated film were measured quantitatively by X-ray diffraction (XRD), its interfacial structures were observed with scanning electron microscope (SEM). The effects of residual stress on bonding strength of zinc-plated film were investigated, and its influence mechanism was discussed. The experimental results show that residual stresses of zinc-plated film are behaved as tensile stress, which increase with its thickness, bonding strength of zinc-plated film is inverse ratio with residual stresses; the effects of residual stress on film crack are obvious, tensile stress speeds film cracking, which decrease its bonding strength; bonding strength of zinc-plated film is increased by improving its residual stress distribution.

• Periodical: Advanced Materials Research (Volume 142)
• Pages: 112-116
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.142.112
• Online since: October 2010
• Authors: Xing Fang Wang
• Keywords: Bonding Strength, Residual Stress, X-Ray Diffraction (XRD), Zinc-Plated Film

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