The Design of Three-Dimensional Vibration Sensor Based on SOI Microfabbrication

Gui Xiong Shi; Guo Jun Zhang; Jiao Xu; Xiao Yao Wang

doi:10.4028/www.scientific.net/AMR.148-149.152

Paper Titles

Experimental Research on the Abrasive Belt Grinding Blades Material 1Cr13 Stainless Steel
p.130

Modeling of Thermal Exposure Effect on the Microstructure Evolution and Properties of High Cu/Mg Ratio Al-Cu-Mg-Ag Alloys
p.136

Stability and Bifurcation of Nonlinear Bearing-Flexible Rotor System with a Single Disk
p.141

The Piston Orthogonal DOE Optimization Based on Multidisciplinary
p.147

The Design of Three-Dimensional Vibration Sensor Based on SOI Microfabbrication
p.152

Study on the Stability in Laser Cladding Forming Process of Thin-Wall Structures
p.157

The Effect of Temperature Fluctuation on the Formation of Billet Surface Defect in the Initial Solidification Area
p.163

Simulation and Experiment Study of Hybrid Actuators Five-Bar Mechanism Kinematics Parameter
p.168

CC Path Generation Method in 5-Axis Surface Machining with a Flat-End Cutter
p.172

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 148-149The Design of Three-Dimensional Vibration Sensor...

The Design of Three-Dimensional Vibration Sensor Based on SOI Microfabbrication

Abstract:

Compared with the traditional vibration sensors, the micro-vibration sensor have many advantages, such as small size, high sensitivity and low noise which is based on micro-fabbrication.This paper introduced the micro-vibration sensors which sensitive structure are cilium and micro-elastic beams. The micro-vibration sensors were produced by the inductively coupled plasma technology (ICP), the maximal etching depth of which can be greater than 300μm, the thickness of beam is less than 20μm and the longth of cilium are more than 3000um.The sensitivity of the sensor is 102.5μV/g, the measurement range to +20g, and the resonant frequency is 2KHz.

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Advanced Materials Research (Volumes 148-149)

Pages:

152-156

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.148-149.152

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Online since:

October 2010

Authors:

Gui Xiong Shi, Guo Jun Zhang, Jiao Xu, Xiao Yao Wang

Keywords:

Ciliumry, ICP, Micro-Electromechanical System (MEMS), Micro-Fabrication, SOI, Vibration Sensor

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