Copper matrix composites reinforced with 3D-SiC network (15v% and 20v% SiC) were fabricated by squeezing copper alloy into 3D-SiC network preforms. The thermo-physical properties of the copper matrix composites were investigated. The specific heat capacities of the composites were about 0.39~0.50 J•g-1•K-1. The coefficients of thermal expansion (CTEs) of the composites were found to be lower than 6.9×10-6 -1 at Room Temperature. The composites exhibited high thermal stability for 3D-SiC network advent. The thermal conductivity of the composites was in the range of 50~80W•m−1•K−1. The thermo-physical properties of Cu matrix composites had a great relationship with the structures of 3D-SiC network preforms. The thermal conductivity of the composites decreased with an increase in the volume fraction of SiC or the structures of the limbs changing compacted, but the CTEs were not completely according this rule.