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Thermal Properties of the Aluminum Particle Reinforced Silicone Rubber Composites

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Abstract:

Micro-sized aluminum (Al) reinforced silicone rubber composites were prepared, and the thermal properties of the composites were investigated in term of composition, shape, and surface modification of Al particles. The results demonstrated that the incorporation of Al particles into the composites improved the peak vulcanization temperature, and decreased the thermal stability behavior of the rubber; furthermore, the shape, concentration, surface treatment of Al particles and temperature had an effect on the thermal conductivity. The thermal conductivity increased obviously with a rise of Al particles concentration, as well as with a surface modification of filler. The flaky Al particles reinforced rubber showed a distinct higher thermal conductivity as compared to the spherical Al particles.

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Periodical:

Advanced Materials Research (Volumes 194-196)

Pages:

1680-1684

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.194-196.1680

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Online since:

February 2011

Authors:

Wen Ying Zhou, Jiang Tao Cai, An Ning Zhou

Keywords:

Aluminum (Al), Microstructure, Silicone Rubber, Thermal Property

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] L. C. Sim, S. L. Ramanan and H. Ismail. Thermochimia Acta 430(2005)155-165.

Google Scholar

[2] R. J. Samuels and N. E. Mathis. J. Electron Packaging123(2001)273-277.

Google Scholar

[3] W. Y. Zhou, C. F. Cai and T. Ai. Composites A 40(2009)830–836.

Google Scholar

[4] R. G. James, Y. V. Yvonne and B. Steven. Carbon 41(2003)2187-2193.

Google Scholar

[5] H. Ishida and S. Rimdusit. Themochim Acta 320(1998)177-186.

Google Scholar

[6] G. W. Lee, P. Min and J. Y. Kim. Composites, Part A 34(2005)1–8.

Google Scholar

[7] W. Y. Zhou and D. M. Yu. J. Appl. Polym. Sci. 118(2010) 3156-3166.

Google Scholar

[8] J. W. Xu and C. P. Wong. Composites Part A 38(2007)13.

Google Scholar

[9] W. Y. Zhou, S. H. Qi and C. C. Tu. J. Appl. Polym. Sci. 104(2007)1312.

Google Scholar

[10] D. P. H. Hasselman and F. J. Lloyd. Journal of Composites 21(1987)508-515.

Google Scholar

[11] Y. S. Xu, D. D. Chung and C. Mroz. Composites, part A 32(2001)1749-1757.

Google Scholar

[12] R. S. Prasher. J. Heat Transfer 123(2001)969-975.

Google Scholar

[13] W. Y. Zhou, D. M. Yu and C. Min. J. Appl. Polym. Sci. 112(2009) 1695-1703.

Google Scholar

[14] W. Y. Zhou, S. H. Qi and Q. L. An. Material Research Bulletin 42(2007)1863-1873.

Google Scholar

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