Direct Writing of Channels for Microfluidics in Silica by MeV Ion Beam Lithography

Nitipon Puttaraksa; Mari Napari; Orapin Chienthavorn; Rattanaporn Norarat; Timo Sajavaara; Mikko Laitinen; Somsorn Singkarat; Harry J. Whitlow

doi:10.4028/www.scientific.net/AMR.254.132

Paper Titles

Multi Degree-of-Freedom Micromotor Utilizing an Electrothermal Actuator Array and a Spherical Rotor
p.115

Area-Selective Polymer Deposition on Micro-Area Framed by Trenches with Falling Liquid Film
p.120

A New Peltier Device with a Coaxial Thermocouple
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A Portable Thermal Cycler Using a PN Sandwich-Structure Peltier Device
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Direct Writing of Channels for Microfluidics in Silica by MeV Ion Beam Lithography
p.132

Studies on Quasi-Static Au-to-Au Ohmic Contact for MEMS Switches
p.136

Double-Step Plasma Etching for SiO₂ Microcantilever Release
p.140

Design, Fabrication and Characterization of ZnO Based Thin Film Bulk Acoustic Resonators
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Development of Multiple-Step SOI DRIE Process for Superior Notch Reduction at Buried Oxide
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 254Direct Writing of Channels for Microfluidics in...

Direct Writing of Channels for Microfluidics in Silica by MeV Ion Beam Lithography

Abstract:

The lithographic exposure characteristic of amorphous silica (SiO₂) was investigated for 6.8 MeV ¹⁶O³⁺ ions. A programmable proximity aperture lithography (PPAL) technique was used for the ion beam exposure. After exposure, the exposed pattern was developed by selective etching in 4% v/v HF. Here, we report on the development of SiO₂ in term of the etch depth dependence on the ion fluence. This showed an exponential approach towards a constant asymptotic etch depth with increasing ion fluence. An example of microfluidic channels produced by this technique is demonstrated.

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Periodical:

Advanced Materials Research (Volume 254)

Pages:

132-135

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.254.132

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Online since:

May 2011

Authors:

Nitipon Puttaraksa, Mari Napari, Orapin Chienthavorn, Rattanaporn Norarat, Timo Sajavaara, Mikko Laitinen, Somsorn Singkarat, Harry J. Whitlow

Keywords:

Direct Writing, Etching, MeV-Ion Beam Lithography, Microfluidic Channels, Silica

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