Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process

Teppei Onuki; Naoto Takagi; Jun Shimizu; Hirotaka Ojima; Li Bo Zhou

doi:10.4028/www.scientific.net/AMR.325.672

Paper Titles

Evaluation of Surface Roughness of Quartz Glass Substrate in Fabrication Process for Neutron Focusing Mirror
p.647

On-Machine Measurement and Statistical Analysis of Wheel Wear after Grinding Optical Glass
p.653

Influence of Wafer Grinding and Etching Techniques on the Fracture Strength of Thin Silicon Substrates
p.659

Silicon Electrochemical Etching for 3D Microforms with High Quality Surfaces
p.666

Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process
p.672

Development of CMG Wheels for Stress Relief in Si Wafer Thinning Process
p.678

On the Reliability of Nanoindentation on Si Wafer at Elevated Temperatures
p.684

Evaluation of Hard Materials Using Eco-Attributes
p.693

Development of Electric Rust Preventive Machining Method -Water Using for Machining: Improvement of Water Recycle System-
p.699

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 325Spectroscopic Measurements of Silicon Wafer...

Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process

Abstract:

The optical microgauge system by means of near-infrared spectroscopic measurements was proposed as the thickness monitoring tool in the silicon wafer thinning process. The Fabry-Pelot interferometry and Beer’s law were employed as the principles of the system for extracting the wafer thickness from optical spectroscopic system prototyped in this study. The specifications of the system such as the thickness range and resolution were examined on the prototyped system. The filed test verified the developed system available of monitoring Si wafer as thin as 5 mm.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 325)

Pages:

672-677

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.325.672

Citation:

Cite this paper

Online since:

August 2011

Authors:

Teppei Onuki, Naoto Takagi, Jun Shimizu, Hirotaka Ojima, Li Bo Zhou

Keywords:

Backgrinding, Beer’s Law, Fabry-Pelot Interferometry, Microgauge, Near Infrared Spectroscopy (NIRS), Optical Meteorology, Wafer Thinning Process

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Jun Shimizu, Libo Zhou, Takeyuki Yamamoto: Journal of Computational and Theoretical Nanoscience, Vol. 7 (2010) pp.2165-2170.

Google Scholar

[2] H. Takahashi, Y.B. Tian, Y. Mikami, J. Shimizu, L. Zhou, Y. Tashiro, H, Iwase and S. Kamiya: Key Engineering Materials, Vol. 447-448 (2010) pp.106-110.

DOI: 10.4028/www.scientific.net/kem.447-448.106

Google Scholar

[3] Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, and Jingshen Wu: J. Electron. Packag. Vol. 126 (2004) pp.110-114.

Google Scholar

[4] Information on http: /www. ioffe. rssi. ru/SVA/NSM/Semicond/Si/optic. html.

Google Scholar

[5] E. Hecht: OPTICS (Pearson Education, 2002).

Google Scholar

[6] J. W. Verhoeven: Pure Appl. Chem., Vol. 68, No. 12 (1996) pp.2223-2286.

Google Scholar