Air Damping Effects of MEMS Parallel-Plate Structure Using ANSYS Thin Film Analysis

Xiong Xing Zhang; Shou Jun Peng; Jin Long Zou

doi:10.4028/www.scientific.net/AMR.403-408.4588

Paper Titles

Fabrication and Test of Electrostatic MEMS Converter Found in Energy Scavenging Systems
p.4557

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components
p.4564

A Novel Autocalibration of 3-Axis MEMS Accelerometers Based on Improved PSO Algorithm
p.4572

A Comparative Study of Thin-Film and Reynolds Equation Simulation Models for Squeeze Film Damping in MEMS Plate Structures
p.4580

Air Damping Effects of MEMS Parallel-Plate Structure Using ANSYS Thin Film Analysis
p.4588

A MEMS Safe and Arm Device for Spin Stabilized Ammunition Fuze
p.4593

Experimental Modal Characterization of MEMS Switches
p.4598

A Simplified Prediction Method for EMI Generated by Three-Phase PWM Rectifier
p.4606

Optimization of Fabrication Process for MEMS Based Microneedles Using ICP Etching Technology
p.4611

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 403-408Air Damping Effects of MEMS Parallel-Plate...

Air Damping Effects of MEMS Parallel-Plate Structure Using ANSYS Thin Film Analysis

Abstract:

ANSYS thin film analysis was adopted to simulate the effects of squeeze film damping. The relation of damping effects versus operating frequency, velocity, material accommodation factor was analyzed, and the gas squeeze film damping and pressure distribution was simulated by steady-state analysis or harmonic analysis. Moreover, pressure distribution of damping effect in plate gap both with perforated holes and without holes, were determined and compared. Simulation results show that operating frequency and the structure of microstructures are the main influencing factors to air damping and perforated holes in plate gap can control stiffness coefficients of squeezed film damping.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 403-408)

Pages:

4588-4592

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.403-408.4588

Citation:

Cite this paper

Online since:

November 2011

Authors:

Xiong Xing Zhang, Shou Jun Peng, Jin Long Zou

Keywords:

Air Damping, MEMS Microstructure, Plate Movement

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Yang Y J. Squeeze-Film Damping for MEMS Structures [D]. Massachusetts: Massachusetts Institute of Technology. (1998).

Google Scholar

[2] Veijola T. Equivalent Circuit Models for Micromechanical Inertial Sensors[R]. Helsinki: Helsinki University of Technology, Theory Laboratory Report Series, (1999).

Google Scholar

[3] J.B. Starr. Squeeze-Film damping in Solid-State Accelerometers. Solid-State Sensor and Actuator Workshop, 1990, pp.44-47.

DOI: 10.1109/solsen.1990.109817

Google Scholar

[4] Feixia P, Joel K, Eric P, et al. Squeeze Film Damping Effect on the Dynamic Response of a MEMS Torsion Mirror [J]. Journal of Micromechanics and Microengineering, 1998, 8(3): 200-208.

DOI: 10.1088/0960-1317/8/3/005

Google Scholar

[5] Satish Vemuri. Behavioral Modeling of Viscous Damping in MEMS [D]. Pennsylvania: Carnegie Mellon Univeristy. (2000).

Google Scholar

[6] Mehner Jan E, Wolfram Doetzel, Bemd Schauwecker, et al. Reduced order modeling of fluid structural interactions in MEMS based on modal projection techniques[R]. Boston: 12th International Conference on Solid-State Sensors, Actuators and Microsystems, 2003: 1840-1843.

DOI: 10.1109/sensor.2003.1217146

Google Scholar

[7] Langlois W E. Isothermal Squeeze Films [J]. International Business Machines Corporation Research Laboratory: Quarterly Applied Mathematics, 1962, 20(2): 131-150.

DOI: 10.1090/qam/99963

Google Scholar

[8] Dale Ostergaard ANSYS inc. Using a heat transfer analogy to solve for squeeze film damping and stiffness coefficients in MEMS structures[EB/OL]. (2003-01-23)[2010-04-21].

Google Scholar