Study on Bonding Technology Parameter Optimize of MEMS Packaging Based on Robust Parameter Design

Jin Wei Yu

doi:10.4028/www.scientific.net/AMR.422.370

Paper Titles

The De-Noising Algorithm Based on Intrinsic Time-Scale Decomposition
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Study of the Parametric Design and Experiment of a Single Unit Integrated Laser Photo-Interrupter
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Transformation of System Action for Reconfigurable Automation Work System
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The Temperature Field Finite Element Analysis and Simulation of One Kind of Magnetic Agitation System
p.365

Study on Bonding Technology Parameter Optimize of MEMS Packaging Based on Robust Parameter Design
p.370

Fabrication and Mechanical Characterization of a Microscale Electrophoretic Polymer Based on MEMS Technology
p.375

Modal Analysis for Swing-Arm of LED Die Bonder
p.379

Study on Lithium Niobate Wafer Bonding and Thinning
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Mechanical Characteristics on Asynchronous Parallel Connection of Linear Ultrasonic Motors
p.387

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 422Study on Bonding Technology Parameter Optimize of...

Study on Bonding Technology Parameter Optimize of MEMS Packaging Based on Robust Parameter Design

Abstract:

In order to improving reliability and economy of down-lead bonding of MEMS packaging , NiPdAu PCB is leaded in ,because palladium is joined in protecting involucra , bonding technology parameter must change . In this paper , robust parameter design method of DOE is used and optimize bonding technology parameter of new type NiPdAu involucra has been discovered , according to optimize results , mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology , not only increasing reliability of products , but also reducing cost of raw materials and obtaining well economy benefit.