Fabrication and Mechanical Characterization of a Microscale Electrophoretic Polymer Based on MEMS Technology

Zhuo Qing Yang; Hong Wang; Zheng Jie Zhang; Gui Fu Ding; Xiao Lin Zhao; Chun Yan Jiang

doi:10.4028/www.scientific.net/AMR.422.375

Paper Titles

Study of the Parametric Design and Experiment of a Single Unit Integrated Laser Photo-Interrupter
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Transformation of System Action for Reconfigurable Automation Work System
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The Temperature Field Finite Element Analysis and Simulation of One Kind of Magnetic Agitation System
p.365

Study on Bonding Technology Parameter Optimize of MEMS Packaging Based on Robust Parameter Design
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Fabrication and Mechanical Characterization of a Microscale Electrophoretic Polymer Based on MEMS Technology
p.375

Modal Analysis for Swing-Arm of LED Die Bonder
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Study on Lithium Niobate Wafer Bonding and Thinning
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Mechanical Characteristics on Asynchronous Parallel Connection of Linear Ultrasonic Motors
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Microfludic and Heat Transfer Performance of Multilayer Fractal-Like Microchannel Network
p.392

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 422Fabrication and Mechanical Characterization of a...

Fabrication and Mechanical Characterization of a Microscale Electrophoretic Polymer Based on MEMS Technology

Abstract:

Microscale polyurethane modified epoxy resin film has been fabricated using MEMS tehnologies in the present paper. The effect of different process conditions on the thickness of fabricated film was discussed. The microscale film shows smooth and uniform surface morphology. The tensile test of the film by DMA indicates its tensile strength and Young's modulus are approximately 55MPa and 1.8GPa, respectively. The fracture section of the film was characterized by SEM. In addition, the interface bonding strength of the fabricated film between Ni substrate is much higher than Parylene-C and SU-8. This microscale polymer film is promising in several smart MEMS fields, especially bio-MEMS structures.