Modal Analysis for Swing-Arm of LED Die Bonder

Wei Chuang Quan; Mei Fa Huang; Zhi Yue Wang; Da Wei Zhang

doi:10.4028/www.scientific.net/AMR.422.379

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 422Modal Analysis for Swing-Arm of LED Die Bonder

Modal Analysis for Swing-Arm of LED Die Bonder

Abstract:

Led die bonder used for bond lead frame and chip is one of the key equipment of led production line. The swing-arm is an important component of led die bonder and its dynamic characteristics will directly affect the piece accuracy. At present, the accuracy and efficiency of led die bonder are limited because of the vibration of the swing-arm. In solving this problem, a three-dimensional finite-element model for swing-arm is built to provide analytical frequencies and vibration modes. Then the modal distribution and vibration mode shapes for swing-arm are obtained after analyzing the modal by ansys10.0. Finally the dynamics effects of this structure by modal frequency and vibration mode are analyzed. The modal analysis of structural would provide the reference to dynamics analysis and structural optimization for swing-arm in practical use.

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Periodical:

Advanced Materials Research (Volume 422)

Pages:

379-382

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.422.379

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Online since:

December 2011

Authors:

Wei Chuang Quan, Mei Fa Huang, Zhi Yue Wang, Da Wei Zhang

Keywords:

LED Die Bonder, Modal Analysis, Swing-Arm

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References

[1] Boyu Liao, Xinming Zhou, Zhihong Yin. Modern Mechanical Dynamics and Application (Mechanical Industry Press, Beijing 2002).

Google Scholar

[2] Qiangsheng Guo. DB_8002 Led Automatic Bonder[J]. Journal of The 45th Research Institute of China Electronics Technology Group Corporation,2008,27(14):11- 19, in Chinese

Google Scholar

[3] Qiangsheng Guo. Led Chip Bonder Pick Up Body Motion Control Technology Research[J]. Journal of The 45th Research Institute of China Electronics Technology Group Corporation, 2005, 33(7):27- 32, in Chinese

Google Scholar

[4] Zhaohui Zhang. Ansys11.0 Resolution Structural Analysis of Engineering Application (Mechanical Industry Press, Beijing 2008).

Google Scholar