Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer

J.J. Li; C.W. Zhao; Y.M. Xing; Z.Y. Lv; Y.G. Du

doi:10.4028/www.scientific.net/AMR.430-432.404

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 430-432Simulation of near-Crack-Tip Strain Fields on...

Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer

Abstract:

The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.

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Periodical:

Advanced Materials Research (Volumes 430-432)

Pages:

404-407

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.430-432.404

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Online since:

January 2012

Authors:

J.J. Li, C.W. Zhao, Y.M. Xing, Z.Y. Lv, Y.G. Du

Keywords:

Crack Tip, Single Crystal Silicon, Strain

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