Influence Mechanism of Curing Shrinkage on Tensile Shear Strength of Isotropic Conductive Adhesive

Abstract:

Based on epoxy resin, Aradur9506 as curing agent and Flake silver powders, isotropic conductive adhesives(ICA) were prepared, The effects of the functional groups of epoxy resin and the addition of curing agent in isothermal cure on the resistivity of the ECA were investigated by FT-IR method, scanning electron microscopy（SEM）and other means. The results indicated that tensile shear strength declined with the increased in the number of epoxy functional groups and raised with the addition of curing agent, and the tensile shear strength was inverse relationship with the curing shrinkage

• Periodical: Advanced Materials Research (Volumes 490-495)
• Pages: 3291-3295
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.490-495.3291
• Online since: March 2012
• Authors: Rui Ming Yin, Liu Gong Wang, Hua Rong Yang, Piao Liu, Jing Li, Fu Bao Ji
• Keywords: Curing Agent, Curing Shrinkage, Isotropic Conductive Adhesive (ICA), Tensile Shear Strength

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