Tool Breakage Feature Extraction in PCB Micro-Hole Drilling Using Vibration Signals

Zhen Hua Ren; Xiao Hu Zheng; Qing Long An; Cheng Yong Wang; Ming Chen

doi:10.4028/www.scientific.net/AMR.497.126

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 497Tool Breakage Feature Extraction in PCB Micro-Hole...

Tool Breakage Feature Extraction in PCB Micro-Hole Drilling Using Vibration Signals

Abstract:

Tool breakage monitoring is crucial to automation fabrication, especially for high-density hole machining, such as PCB (Printed Circuit Board). A tool breakage feature extraction method in PCB micro-hole drilling is presented in this paper. The vibration signal is analyzed by wavelet transform. The decomposed signals energy ratio at each frequency band is computed as monitoring features. The monitoring performance of different features selection is given. The vibration signals are observed to provide the capability in distinguishing micro drill breakage with proper features extraction and classifier design.

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Periodical:

Advanced Materials Research (Volume 497)

Pages:

126-131

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.497.126

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Online since:

April 2012

Authors:

Zhen Hua Ren, Xiao Hu Zheng, Qing Long An, Cheng Yong Wang, Ming Chen

Keywords:

Feature Extraction, PCB Micro-Hole Drilling, Tool Breakage, Vibration, Wavelet Transform (WT)

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