The Simulation Study of Si3N4 Ceramics Nano-Cutting Process

Hai Yan Gao; Ke Zhang; Guo Zhi Liu; Hong Sun; Yu Lan Tang

doi:10.4028/www.scientific.net/AMR.500.371

Paper Titles

Finite Element Analysis for Ti-6Al-4V in Ultrasonic-Vibration-Assisted Micro-Cutting
p.345

Molecular Dynamics Simulation of the Ablation Process in Ultrashort Pulsed Laser Machining of Polycrystalline Diamond
p.351

Experimental Study of Cutting Forces in Micro End-Milling
p.357

Femtosecond Laser Machining of High Permeability Permalloy
p.363

The Simulation Study of Si₃N₄Ceramics Nano-Cutting Process
p.371

Research on Surface Topography and Tool Wear in Micro-Turn-Milling of Micro-Screw
p.377

An Optimized Sheet Metal Forming Process Using Non-Isothermal Heating System
p.385

FEM Analysis of Extrusion of Triangular Sections from Round Billets through Curved Dies
p.391

Studies on the Cooling Effects of Water Cooling Channels in Die Casting Die in Finite Element Method
p.397

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The Simulation Study of Si₃N₄Ceramics Nano-Cutting Process

Abstract:

Silicon nitride nanoscale cutting model was established by molecular dynamics simulation, and interactions force between atoms of work-piece was calculated by Tersoff potential function. Through the three-dimensional simulation of silicon nitride nanocutting process, the changes of cutting force, kinetic energy and potential energy in the nanoscale cutting process, and the effects of cutting thickness and cutting speed on the entire cutting process were analyzed. The results showed that the kinetic energy, potential energy and cuting force increased along with the cutting thickness increasing, both kinetic energy and potential energy decreased with cutting speed increasing.