Electroless Ni-B Alloy Plating from DMF at Room Temperature

Abstract:

A new basic solution for eletroless Ni-B alloy plating from DMF was studied. The effects of composition and operating conditions on the rate of deposition of Ni-B alloy have also been discussed. The alloy component was analyzed by EDS and Inductively Coupled Plasma (ICP). The plating rate is determined by electronic balance. And structures of the plating coatings were investigated by means of scanning electron microscopy (SEM) and X-ray diffraction (XRD).The optimum composition and operating conditions for abstaining satisfied Ni-B alloy coating are provided.

• Periodical: Advanced Materials Research (Volumes 557-559)
• Pages: 1772-1776
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.557-559.1772
• Online since: July 2012
• Authors: Jian Chao Wang, Shu Hai Wang, Guang Ye, Bo Zhai
• Keywords: DMF, Electroless Plating (EP), Ni-B Alloy

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