Superhydrophobic Sol-Gel Films Based on Copper Wafer and its Anti-Corrosive Properties

You Hua Fan; Chang Zhu Li; Ze Jun Chen; Hong Chen

doi:10.4028/www.scientific.net/AMR.557-559.1777

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 557-559Superhydrophobic Sol-Gel Films Based on Copper...

Superhydrophobic Sol-Gel Films Based on Copper Wafer and its Anti-Corrosive Properties

Abstract:

Superhydrophobic copper wafer was prepared using a sol-gel deposition method in the paper. The best superhydrophobic film was prepared with vinyltrimethoxysilane (VTES), ethanol (EtOH), water (H2O) and ammonium hydroxide (NH4OH) at a molar ratio of 1:62.79:8.58:1.49 respectively. The morphologies, chemical compositions and hydrophobicity of the substrates were analyzed by scanning electron microscopy (SEM), energy dispersive X-ray detector (EDX) and water contact angle measurement (CA). The surface morphological study showed that “lotus like structure” silica particles distributed on the copper substrate. The coatings showed the CA as high as 157.8°. The durability properties revealed that the coatings had a good superhydrophobicity deposited in 3.5 wt % sodium chloride solution for up to 14 days.

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Periodical:

Advanced Materials Research (Volumes 557-559)

Pages:

1777-1781

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.557-559.1777

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Online since:

July 2012

Authors:

You Hua Fan, Chang Zhu Li, Ze Jun Chen, Hong Chen

Keywords:

Anti-Corrosive Properties, Copper Wafer, Sol-Gel Deposition, Superhydrophobic

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