Mechanical Properties and Microstructure of Two- Layered Cu-Ni-Zn/Cu-Cr Material Joined by Diffusion Bonding

Abstract:

Two-layered Cu-Ni-Zn/Cu-Cr clad material was prepared by high temperature diffusion bonding and their mechanical performances were examined. Tensile testing was performed on Cu-Ni-Zn/Cu-Cr with the interface plane perpendicular to the stress axis. No intermetallic compounds were observed at Cu-Cr/Cu-Ni-Zn interfaces. In the deformed as-bonded specimen, plastic deformation took place mostly in the softer Cu-Cr alloy although some slip traces and surface irregularity due to grain distortion are discernable in Cu-Ni-Zn alloy. In the deformed heat-treated Cu-Ni-Zn/Cu-Cr, the strength of Cu-Cr increased significantly and plastic deformation occurred mainly in Cu-Ni-Zn with some indication of slight deformation in Cu-Cr close to the interface. Fracture occurred in the necked region of the softer material. The excellent mechanical reliability and the good interfacial bonding strength can be attributed to the absence of detrimental interfacial reaction compounds between Cu-Ni-Zn and Cu-Cr.

• Periodical: Advanced Materials Research (Volumes 557-559)
• Pages: 423-426
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.557-559.423
• Online since: July 2012
• Authors: Ho Byung Kim, Ki Hwan Oh, Sun Ig Hong
• Keywords: Clad, Cu-Cr, Cu-Ni-Zn, Diffusion Bonding (DB)

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