Static Properties Research of Grinding Dynamometer for Wafer Grinder

Jun Zhang; Yin Bai; Min Qian

doi:10.4028/www.scientific.net/AMR.565.603

Paper Titles

A Non-Dimensional Analysis of Tool Edge Radius Effect on the Mechanics of Micromachining
p.576

Influence of Centrifugal Force on Characteristics of Turbine Shaft for Micro-Spindle for Micro-Cutting
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Effect of Machining of Small Tools by Means of Focused Ion Beam
p.588

Application of Cavitation Aided Abrasive Machining to Manufacture of Micro Air Vents on Injection Molds
p.597

Static Properties Research of Grinding Dynamometer for Wafer Grinder
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Development of Ultra-Precision Grinder for 300mm Wafers
p.609

Deposition and Tribological Properties of CVD Diamond/Diamond-Like Carbon Composite Films
p.615

Thermal Analysis of Multi-Pass Laser Irradiation on Fused Silica
p.621

Study on Friction Coefficient between Carbon/Epoxy Composites and a Monocrystalline Diamond under Different Temperatures
p.627

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 565Static Properties Research of Grinding Dynamometer...

Static Properties Research of Grinding Dynamometer for Wafer Grinder

Abstract:

Grinding force is strongly related to grinding process, and the application of dynamometer for its measurement during machining is essential for investigating, monitoring and optimizing the grinding process. This paper presents an innovative dynamometer for triaxial grinding force measurement, specifically designed for an ultra-precision grinder. Two different kinds of spatial arrangements are discussed, including lozenge and square arrangement. The mathematical model is established and calculated. Furthermore, a series of static calibration tests have been conducted for the dynamometer, and static properties of the grinding area are also measured and analyzed. Eventually, on-line static tests of the dynamometer installed in silicon wafer grinder are performed. The results show that the grinding dynamometer has excellent properties, which reach the CIRP standards and meet the working requirements of the ultra-precision grinder.

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Periodical:

Advanced Materials Research (Volume 565)

Pages:

603-608

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.565.603

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Online since:

September 2012

Authors:

Jun Zhang, Yin Bai, Min Qian

Keywords:

Dynamometer, Grinding Force, Piezoelectric Effect, Silicon Wafer

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References

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