Development of Ultra-Precision Grinder for 300mm Wafers

Abstract:

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2µm/300mm.

• Periodical: Advanced Materials Research (Volume 565)
• Pages: 609-614
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.565.609
• Online since: September 2012
• Authors: X.L. Zhu, Z.G. Dong, Ren Ke Kang, D.M. Guo
• Keywords: Online Monitoring, Precision Grinding, Silicon Wafer, Wafer Grinder

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